Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9082840 | Coating adhesives onto dicing before grinding and micro-fabricated wafers | Jeffrey W. Leon, Raj Peddi, YounSang Kim | 2015-07-14 |
| 8753959 | Coating adhesives onto dicing before grinding and micro-fabricated wafers | Jeffrey W. Leon, Raj Peddi, YounSang Kim | 2014-06-17 |
| 8075721 | Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability | Qing Ji, Chew B. Chan, Renzhe Zhao, Weitong Shi | 2011-12-13 |
| 5543493 | Method for treating a polyimide surface | Chan Eon Park, Sung-Min Sim, Wan Choi | 1996-08-06 |