Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8648460 | Thermal interface material with epoxidized nutshell oil | My N. Nguyen | 2014-02-11 |
| 8273606 | Method of fabricating a semiconductor package using a fluxing underfill composition applied to solder balls in a dip process | Qing Ji, Mark Currie, Neil Poole, Geraldine Kelly | 2012-09-25 |
| 8075721 | Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability | Qing Ji, Hwang Kyu Yun, Renzhe Zhao, Weitong Shi | 2011-12-13 |