Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8273606 | Method of fabricating a semiconductor package using a fluxing underfill composition applied to solder balls in a dip process | Chew B. Chan, Qing Ji, Mark Currie, Neil Poole | 2012-09-25 |