Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8273606 | Method of fabricating a semiconductor package using a fluxing underfill composition applied to solder balls in a dip process | Chew B. Chan, Qing Ji, Mark Currie, Geraldine Kelly | 2012-09-25 |
| 5225272 | Polymeric film | Thane Colin Gough | 1993-07-06 |