Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11974390 | Reduction of packaging substrate deformation | Lori Ann DeOrio, Anthony James LoBianco, Hoang Mong Nguyen, Robert Francis Darveaux | 2024-04-30 |
| 11596056 | Methods and devices related to reduced packaging substrate deformation | Lori Ann DeOrio, Anthony James LoBianco, Hoang Mong Nguyen, Robert Francis Darveaux | 2023-02-28 |
| 10141901 | Flip-chip amplifier with termination circuit | Guohao Zhang, Hardik Bhupendra Modi, Jaydutt Jagdish Joshi, Dinhphuoc Vu Hoang | 2018-11-27 |
| 9467940 | Flip-chip linear power amplifier with high power added efficiency | Guohao Zhang, Hardik Bhupendra Modi, Jaydutt Jagdish Joshi, Dinhphuoc Vu Hoang | 2016-10-11 |