Sunil A. Patel — 15 Patents | Patent Leaderboard

Sunil A. Patel has been granted 15 US patents. The first was granted in 1999 and the most recent in December 2022. Sunil A. Patel ranks #307,048 of 4,157,543 US inventors in our database (top 7.4%). Patent records list Sunil A. Patel in Fremont, CA, US.

Patents per Year

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Showing 1–15 of 15 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11533813	Touchscreen display panel gripping mechanism and bezel	Cheyenne Matthews, Jason A. Myren, Michael P. Matessa, Devin Elbert, Richard T. Stone +1 more	2022-12-20
10292278	Compact printed circuit board assembly with insulating endcap via	Thomas Lee Schick, Robert A. Matousek	2019-05-14	$15,767,000
9888360	Methods to optimize and streamline AP placement on floor plan	Abhinav Sharma, Murthy S. Vempati, Saumitra Mohan Das, Chandrakant Mehta, Rupali T. Desai	2018-02-06	$25,183,000
7383049	Automation of maintenance and improvement of location service parameters in a data base of a wireless mobile communication system	James Douglass DeLoach, Jr., Alkinoos Vayanos, Bruce G. Wilson, Richard Girerd, Grant Alexander Marshall +5 more	2008-06-03	$81,101,000
6618938	Interposer for semiconductor package assembly	Maniam Alagaratnam, Kishor Desai	2003-09-16	$7,469,000
6466038	Non-isothermal electromigration testing of microelectronic packaging interconnects	Senol Pekin	2002-10-15	$4,502,000
6433565	Test fixture for flip chip ball grid array circuits	Kishor Desai, Maniam Alagaratnam	2002-08-13	$4,311,000
6335491	Interposer for semiconductor package assembly	Maniam Alagaratnam, Kishor Desai	2002-01-01
6306751	Apparatus and method for improving ball joints in semiconductor packages	Chok J. Chia, Kishor Desai	2001-10-23	$38,059,000
6266249	Semiconductor flip chip ball grid array package	Kishor Desai, Ramaswamy Ranganathan	2001-07-24	$16,704,000
6166434	Die clip assembly for semiconductor package	Kishor Desai, John McCormick	2000-12-26	$19,369,000
6020221	Process for manufacturing a semiconductor device having a stiffener member	Sengsooi Lim, Ramaswamy Ranganathan	2000-02-01	$61,681,000
6002171	Integrated heat spreader/stiffener assembly and method of assembly for semiconductor package	Kishor Desai, John McCormick	1999-12-14	$33,483,000
5998242	Vacuum assisted underfill process and apparatus for semiconductor package fabrication	Galen Kirkpatrick, Manickam Thavarajah, Stephen A. Murphy	1999-12-07	$13,290,000
5909057	Integrated heat spreader/stiffener with apertures for semiconductor package	John McCormick	1999-06-01	$17,274,000

Sunil A. Patel — 15 Patents

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