Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same

Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same

US Patent 5854085 · Granted Dec 29, 1998

Estimated economic value: $7,445,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Fine pitch copper pillar package and method2025
Fine pitch copper pillar package and method2021
Fine pitch copper pillar package and method2019
Fine pitch copper pillar package and method2019
Fine pitch copper pillar package and method2016
Methods for temporary bussing of semiconductor package substrates2016
Electrical circuit with component-accommodating lid2014
Fine pitch copper pillar package and method2013
Multi chip module assembly2006
Via construction for structural support2005
Method of forming electrolytic contact pads including layers of copper, nickel, 2004
Bonding pad interface2004