Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7064009 | Thermally enhanced chip scale lead on chip semiconductor package and method of making same | David McCann, Paul R. Hoffman | 2006-06-20 |
| 7045883 | Thermally enhanced chip scale lead on chip semiconductor package and method of making same | David McCann, Paul R. Hoffman | 2006-05-16 |
| 6873032 | Thermally enhanced chip scale lead on chip semiconductor package and method of making same | David McCann, Paul R. Hoffman | 2005-03-29 |
| 6597059 | Thermally enhanced chip scale lead on chip semiconductor package | David McCann, Paul R. Hoffman | 2003-07-22 |
| 5598031 | Electrically and thermally enhanced package using a separate silicon substrate | William K. Shu, Sang S. Lee, George Fujimoto | 1997-01-28 |
| 5530281 | Wirebond lead system with improved wire separation | Matthew W. Preston | 1996-06-25 |