Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5872395 | Bent tip method for preventing vertical motion of heat spreaders during injection molding of IC packages | — | 1999-02-16 |
| 5817941 | Method and apparatus for supporting a sensor in a vehicle | Willfred Marc Stalnaker, Victor Wayne Ramsey, Gerald K. Fehr, David Alexander St. Clair V | 1998-10-06 |
| 5598031 | Electrically and thermally enhanced package using a separate silicon substrate | Richard L. Groover, William K. Shu, Sang S. Lee | 1997-01-28 |
| 5379187 | Design for encapsulation of thermally enhanced integrated circuits | Sang S. Lee | 1995-01-03 |