Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7867806 | Electronic component structure and method of making | Bhret Graydon | 2011-01-11 |
| 7782629 | Embedding an electronic component between surfaces of a printed circuit board | Bhret Graydon | 2010-08-24 |
| 6503820 | Die pad crack absorption system and method for integrated circuit chip fabrication | — | 2003-01-07 |
| 6037669 | Staggered pad array | Robert L. Payne | 2000-03-14 |
| 6020647 | Composite metallization structures for improved post bonding reliability | Stephen L. Skala, Subhas Bothra, Dipu Pramanik | 2000-02-01 |
| 5675179 | Universal test die and method for fine pad pitch designs | Brian D. Richardson | 1997-10-07 |
| 5598031 | Electrically and thermally enhanced package using a separate silicon substrate | Richard L. Groover, Sang S. Lee, George Fujimoto | 1997-01-28 |
| 5525839 | Method of packing an IC die in a molded plastic employing an ultra-thin die coating process | — | 1996-06-11 |
| 5153507 | Multi-purpose bond pad test die | Carl H. Fong | 1992-10-06 |