Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6355969 | Programmable integrated circuit structures and methods for making the same | Subhas Bothra | 2002-03-12 |
| 6261939 | Pad metallization over active circuitry | Subhas Bothra, Emmanuel Demuizon | 2001-07-17 |
| 6221759 | Method for forming aligned vias under trenches in a dual damascene process | Subhas Bothra | 2001-04-24 |
| 6191481 | Electromigration impeding composite metallization lines and methods for making the same | Subhas Bothra, Dipu Pramanik | 2001-02-20 |
| 6054378 | Method for encapsulating a metal via in damascene | Subhas Bothra | 2000-04-25 |
| 6020647 | Composite metallization structures for improved post bonding reliability | Subhas Bothra, Dipu Pramanik, William K. Shu | 2000-02-01 |