Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Test system with a thermal head comprising a plurality of adapters for independent thermal control of zones

Test system with a thermal head comprising a plurality of adapters for independent thermal control of zones

US Patent 11828795 · Granted Nov 28, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Encapsulant-defined land grid array (LGA) package and method for making the same2025
Quad flat no-lead (QFN) package with tie bars and direct contact interconnect bu2025
Semiconductor assembly comprising a 3D block and method of making the same2025
Embedded component interposer or substrate comprising displacement compensation 2025
Multi-chip or multi-chiplet fan-out device for laminate and leadframe packages2025
Carrier based high volume system level testing of devices with pop structures2025
Method of making a fan-out semiconductor assembly with an intermediate carrier2025
Integrated test cell using active thermal interposer (ATI) with parallel socket 2025
Wafer scale active thermal interposer for device testing2025
Passive carrier-based device delivery for slot-based high-volume semiconductor t2025
Fully molded structure with multi-height components comprising backside conducti2025
Thermal head comprising a plurality of adapters for independent thermal control 2025