Issued Patents All Time
Showing 26–50 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6614102 | Shielded semiconductor leadframe package | Doug Mathews | 2003-09-02 |
| 6603183 | Quick sealing glass-lidded package | — | 2003-08-05 |
| 6597059 | Thermally enhanced chip scale lead on chip semiconductor package | David McCann, Richard L. Groover | 2003-07-22 |
| 6576998 | Thin semiconductor package with semiconductor chip and electronic discrete device | — | 2003-06-10 |
| 6489667 | Semiconductor device and method of manufacturing such device | Il Kwon Shim, Chang Kyu Park, Byung Joon Han, Vincent DiCaprio | 2002-12-03 |
| 6462274 | Chip-scale semiconductor package of the fan-out type and method of manufacturing such packages | Il Kwon Shim, Chang Kyu Park, Byung Joon Han, Vincent DiCaprio | 2002-10-08 |
| 6423576 | Microelectronic device package having a heat sink structure for increasing the thermal conductivity of the package | — | 2002-07-23 |
| 6414396 | Package for stacked integrated circuits | Il Kwon Shim, Vincent DiCaprio, Byung Joon Han | 2002-07-02 |
| 6300673 | Edge connectable metal package | James M. Popplewell, Jeffrey S. Braden | 2001-10-09 |
| 6262477 | Ball grid array electronic package | Deepak Mahulikar, Jeffrey S. Braden | 2001-07-17 |
| 6028354 | Microelectronic device package having a heat sink structure for increasing the thermal conductivity of the package | — | 2000-02-22 |
| 5952719 | Metal ball grid electronic package having improved solder joint | Peter W. Robinson, Deepak Mahulikar | 1999-09-14 |
| 5877551 | Semiconductor package having a ground or power ring and a metal substrate | Salvador Tostado, George A. Brathwaite, George A. Erfe, Serafin P. Pedron, Jr., Michael A. Raftery +3 more | 1999-03-02 |
| 5805427 | Ball grid array electronic package standoff design | — | 1998-09-08 |
| 5764484 | Ground ring for a metal electronic package | Markus K. Liebhard | 1998-06-09 |
| 5629835 | Metal ball grid array package with improved thermal conductivity | Deepak Mahulikar, Jeffrey S. Braden | 1997-05-13 |
| 5578869 | Components for housing an integrated circuit device | Deepak Mahulikar, George A. Brathwaite, Dawit Solomon, Arvind Parthasarathi | 1996-11-26 |
| 5545850 | Guard ring for integrated circuit package | Deepak Mahulikar | 1996-08-13 |
| 5506446 | Electronic package having improved wire bonding capability | George A. Brathwaite, Doanh D. Bui, Deepak Mahulikar | 1996-04-09 |
| 5477008 | Polymer plug for electronic packages | Anthony M. Pasqualoni, Deepak Mahulikar, Francis S. Jewell, George A. Brathwaite, Richard Paul McNabb +1 more | 1995-12-19 |
| 5455386 | Chamfered electronic package component | George A. Brathwaite, German Ramirez, Michael A. Holmes, Dexin Liang | 1995-10-03 |
| 5455387 | Semiconductor package with chip redistribution interposer | Keshav Prasad, Thomas Caulfield, Sean T. Crowley | 1995-10-03 |
| 5399805 | Metal electronic package with reduced seal width | Derek E. Tyler, Deepak Mahulikar, Anthony M. Pasqualoni, Jeffrey S. Braden | 1995-03-21 |
| 5360942 | Multi-chip electronic package module utilizing an adhesive sheet | Dexin Liang | 1994-11-01 |
| 5324888 | Metal electronic package with reduced seal width | Derek E. Tyler, Deepak Mahulikar, Anthony M. Pasqualoni, Jeffrey S. Braden | 1994-06-28 |