| 6504105 |
Solder ball connections and assembly process |
John Acocella, Donald R. Banks, Joseph A. Benenati, Karl G. Hoebener, David P. Watson +1 more |
2003-01-07 |
| 5675889 |
Solder ball connections and assembly process |
John Acocella, Donald R. Banks, Joseph A. Benenati, John Saunders Corbin, Jr., Karl G. Hoebener +1 more |
1997-10-14 |
| 5591941 |
Solder ball interconnected assembly |
John Acocella, Donald R. Banks, Joseph A. Benenati, Karl G. Hoebener, David P. Watson +1 more |
1997-01-07 |
| 5525328 |
Nanoparticulate diagnostic diatrizoxy ester X-ray contrast agents for blood pool and lymphatic system imaging |
Edward R. Bacon, Carl R. Illig, Irennegbe Kelly Osifo |
1996-06-11 |
| 5455387 |
Semiconductor package with chip redistribution interposer |
Paul R. Hoffman, Keshav Prasad, Sean T. Crowley |
1995-10-03 |
| 5066544 |
Dispersion strengthened lead-tin alloy solder |
Hemant S. Betrabet, Otmar H. Boser, Robert H. Kane, Susan McGee |
1991-11-19 |
