Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9305889 | Leadless integrated circuit package having standoff contacts and die attach pad | John R. McMillan, Adonis Fung, Serafin P. Pedron, Jr. | 2016-04-05 |
| 8828801 | Leadless array plastic package with various IC packaging configurations | John R. McMillan, Serafin P. Pedron, Jr., Adonis Fung | 2014-09-09 |
| 8736037 | Leadless integrated circuit package having standoff contacts and die attach pad | John R. McMillan, Adonis Fung, Serafin P. Pedron, Jr. | 2014-05-27 |
| 8486762 | Leadless array plastic package with various IC packaging configurations | John R. McMillan, Serafin P. Pedron, Jr., Adonis Fung | 2013-07-16 |
| 7858443 | Leadless integrated circuit package having standoff contacts and die attach pad | John R. McMillan, Adonis Fung, Serafin P. Pedron, Jr. | 2010-12-28 |