AF

Adonis Fung

UL Utac Hong Kong Limited: 5 patents #1 of 14Top 8%
Overall (All Time): #997,742 of 4,157,543Top 25%
5
Patents All Time

Issued Patents All Time

Showing 1–5 of 5 patents

Patent #TitleCo-InventorsDate
9305889 Leadless integrated circuit package having standoff contacts and die attach pad Kirk Powell, John R. McMillan, Serafin P. Pedron, Jr. 2016-04-05
8828801 Leadless array plastic package with various IC packaging configurations John R. McMillan, Serafin P. Pedron, Jr., Kirk Powell 2014-09-09
8736037 Leadless integrated circuit package having standoff contacts and die attach pad Kirk Powell, John R. McMillan, Serafin P. Pedron, Jr. 2014-05-27
8486762 Leadless array plastic package with various IC packaging configurations John R. McMillan, Serafin P. Pedron, Jr., Kirk Powell 2013-07-16
7858443 Leadless integrated circuit package having standoff contacts and die attach pad Kirk Powell, John R. McMillan, Serafin P. Pedron, Jr. 2010-12-28