Issued Patents All Time
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9006912 | Printed circuit board with coextensive electrical connectors and contact pad areas | Chih-Chin Liao, Han-Shiao Chen, Chin-Tien Chiu, Ken Jian Ming Wang, Hem Takiar | 2015-04-14 |
| 8878346 | Molded SiP package with reinforced solder columns | Chin-Tien Chiu, Hem Takiar, Hui Liu, Jiang Zhu, Jack Chang-Chien | 2014-11-04 |
| 8728864 | Method of fabricating a memory card using SIP/SMT hybrid technology | Ning Ye, Robert C. Miller, Hem Takiar, Andre McKenzie | 2014-05-20 |
| 8637972 | Two-sided substrate lead connection for minimizing kerf width on a semiconductor substrate panel | Chih-Chin Liao, Ning Ye, Jack Chang Chien, Hem Takiar | 2014-01-28 |
| 8487441 | Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging | Chin-Tien Chiu, Chih-Chin Liao, Ken Jian Ming Wang, Han-Shiao Chen, Hem Takiar | 2013-07-16 |
| 8470640 | Method of fabricating stacked semiconductor package with localized cavities for wire bonding | Hem Takiar, Shrikar Bhagath, Chih-Chin Liao | 2013-06-25 |
| 8395246 | Two-sided die in a four-sided leadframe based package | Vani Verma, Hem Takiar | 2013-03-12 |
| 8318535 | Method of fabricating a memory card using SiP/SMT hybrid technology | Ning Ye, Robert C. Miller, Hem Takiar, Andre McKenzie | 2012-11-27 |
| 8294251 | Stacked semiconductor package with localized cavities for wire bonding | Hem Takiar, Shrikar Bhagath, Chih-Chin Liao | 2012-10-23 |
| 8212360 | Semiconductor die having a redistribution layer | Chien-Ko Liao, Chin-Tien Chiu, Jack Chang Chien, Hem Takiar | 2012-07-03 |
| 8097495 | Die package with asymmetric leadframe connection | Ming-Hsun Lee, Chih-Chin Liao, Hem Takiar | 2012-01-17 |
| 8058099 | Method of fabricating a two-sided die in a four-sided leadframe based package | Vani Verma, Hem Takiar | 2011-11-15 |
| 7967184 | Padless substrate for surface mounted components | Chih-Chin Liao, Ken Jian Ming Wang, Han-Shiao Chen, Chin-Tien Chiu, Jack Chang Chien +2 more | 2011-06-28 |
| 7952179 | Semiconductor package having through holes for molding back side of package | Chin-Tien Chiu, Hem Takiar, Chih-Chin Liao, Ning Ye, Jack Chang Chien | 2011-05-31 |
| 7939382 | Method of fabricating a semiconductor package having through holes for molding back side of package | Chin-Tien Chiu, Hem Takiar, Chih-Chin Liao, Ning Ye, Jack Chang Chien | 2011-05-10 |
| 7806731 | Rounded contact fingers on substrate/PCB for crack prevention | Hem Takiar, Ken Jian Ming Wang, Chin-Tien Chiu, Han-Shiao Chen, Chih-Chin Liao | 2010-10-05 |
| 7772107 | Methods of forming a single layer substrate for high capacity memory cards | Hem Takiar, Chih-Chin Liao | 2010-08-10 |
| 7772047 | Method of fabricating a semiconductor die having a redistribution layer | Chien-Ko Liao, Chin-Tien Chiu, Jack Chang Chien, Hem Takiar | 2010-08-10 |
| 7772686 | Memory card fabricated using SiP/SMT hybrid technology | Ning Ye, Robert C. Miller, Hem Takiar, Andre McKenzie | 2010-08-10 |
| 7763980 | Semiconductor die having a distribution layer | Chien-Ko Liao, Chin-Tien Chiu, Jack Chang Chien, Hem Takiar | 2010-07-27 |
| 7746661 | Printed circuit board with coextensive electrical connectors and contact pad areas | Chih-Chin Liao, Han-Shiao Chen, Chin-Tien Chiu, Ken Jian Ming Wang, Hem Takiar | 2010-06-29 |
| 7728411 | COL-TSOP with nonconductive material for reducing package capacitance | Ming-Hsun Lee, Hem Takiar | 2010-06-01 |
| 7663216 | High density three dimensional semiconductor die package | Chih-Chin Liao, Hem Takiar | 2010-02-16 |
| 7615409 | Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages | Chih-Chin Liao, Hem Takiar | 2009-11-10 |
| 7615861 | Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards | Che-Jung Chang, Chin-Tien Chiu, Hem Takiar, Jack Chang Chien, Ning Liu | 2009-11-10 |