Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8637972 | Two-sided substrate lead connection for minimizing kerf width on a semiconductor substrate panel | Chih-Chin Liao, Ning Ye, Cheemen Yu, Hem Takiar | 2014-01-28 |
| 8499813 | System for separating a diced semiconductor die from a die attach tape | King Hoo Ong, Weili Wang, Li-Ping Wang, XingZhi Liang, Shicai Ma | 2013-08-06 |
| 8482139 | Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards | Che-Jung Chang, Chin-Tien Chiu, Cheeman Yu, Hem Takiar, Ning Liu | 2013-07-09 |
| 8232145 | Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards | Che-Jung Chang, Chin-Tien Chiu, Cheeman Yu, Hem Takiar, Ning Liu | 2012-07-31 |
| 8212360 | Semiconductor die having a redistribution layer | Chien-Ko Liao, Chin-Tien Chiu, Cheemen Yu, Hem Takiar | 2012-07-03 |
| 7967184 | Padless substrate for surface mounted components | Chih-Chin Liao, Ken Jian Ming Wang, Han-Shiao Chen, Chin-Tien Chiu, Shrikar Bhagath +2 more | 2011-06-28 |
| 7952179 | Semiconductor package having through holes for molding back side of package | Chin-Tien Chiu, Hem Takiar, Chih-Chin Liao, Cheemen Yu, Ning Ye | 2011-05-31 |
| 7939944 | Semiconductor die having a redistribution layer | Chien-Ko Liao, Chin-Tien Chiu, Cheeman Yu, Hem Takiar | 2011-05-10 |
| 7939382 | Method of fabricating a semiconductor package having through holes for molding back side of package | Chin-Tien Chiu, Hem Takiar, Chih-Chin Liao, Cheemen Yu, Ning Ye | 2011-05-10 |
| 7772047 | Method of fabricating a semiconductor die having a redistribution layer | Chien-Ko Liao, Chin-Tien Chiu, Cheemen Yu, Hem Takiar | 2010-08-10 |
| 7763980 | Semiconductor die having a distribution layer | Chien-Ko Liao, Chin-Tien Chiu, Cheemen Yu, Hem Takiar | 2010-07-27 |
| 7615861 | Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards | Che-Jung Chang, Chin-Tien Chiu, Cheemen Yu, Hem Takiar, Ning Liu | 2009-11-10 |
| 7611927 | Method of minimizing kerf width on a semiconductor substrate panel | Chih-Chin Liao, Ning Ye, Cheemen Yu, Hem Takiar | 2009-11-03 |