| 12438703 |
Secure multi-party computation methods, apparatuses, and systems |
Yueming Lu, Lei Wang, Jian-Zoing Tan |
2025-10-07 |
|
| 10229886 |
Discrete component backward traceability and semiconductor device forward traceability |
Didier Chavet |
2019-03-12 |
|
| 10051733 |
Printed circuit board with coextensive electrical connectors and contact pad areas |
Chih-Chin Liao, Han-Shiao Chen, Chin-Tien Chiu, Ken Jian Ming Wang, Hem Takiar |
2018-08-14 |
|
| 9773766 |
Semiconductor device including independent film layer for embedding and/or spacing semiconductor die |
Ning Ye, Chin-Tien Chiu, Suresh Upadhyayula, Peng-Fei Fu, Zhong Lu +7 more |
2017-09-26 |
|
| 9704797 |
Waterfall wire bonding |
Zhong Lu, Fen Yu, Chin-Tien Chiu, Fuqiang Xiao |
2017-07-11 |
|
| 9362244 |
Wire tail connector for a semiconductor device |
Chin-Tien Chiu, Hem Takiar |
2016-06-07 |
|
| 9337153 |
EMI shielding and thermal dissipation for semiconductor device |
Peng-Fei Fu, Shan Luo, Zhong Lu, Kaiyou Qian, Chin-Tien Chiu +2 more |
2016-05-10 |
|
| 9331045 |
Semiconductor die laminating device with independent drives |
Wei Gu, Zhong Lu, Chin-Tien Chiu, En-Yong Tai, Min Ni |
2016-05-03 |
|
| 9240393 |
High yield semiconductor device |
Zhong Lu, Gursharan Singh, Wei Gu |
2016-01-19 |
|
| 9236368 |
Semiconductor device including embedded controller die and method of making same |
Shiv Shankar Kumar, Chin-Tien Chiu, Kaiyou Qian |
2016-01-12 |
|
| 9230919 |
Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging |
Chin-Tien Chiu, Chih-Chin Liao, Ken Jian Ming Wang, Han-Shiao Chen, Hem Takiar |
2016-01-05 |
$5,322,000 |
| 9209159 |
Hidden plating traces |
Hem Takiar, Ken Jian Ming Wang, Chin-Tien Chiu, Han-Shiao Chen, Chih-Chin Liao |
2015-12-08 |
$15,104,000 |
| 8878368 |
Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging |
Chin-Tien Chiu, Chih-Chin Liao, Ken Jian Ming Wang, Han-Shiao Chen, Hem Takiar |
2014-11-04 |
$7,444,000 |
| 8853863 |
Semiconductor device with die stack arrangement including staggered die and efficient wire bonding |
Chin-Chin Liao, Ya Huei Lee |
2014-10-07 |
$13,334,000 |
| 8653653 |
High density three dimensional semiconductor die package |
Chih-Chin Liao, Hem Takiar |
2014-02-18 |
$46,748,000 |
| 8502375 |
Corrugated die edge for stacked die semiconductor package |
Chih-Chin Liao |
2013-08-06 |
$7,655,000 |
| 8482139 |
Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards |
Che-Jung Chang, Chin-Tien Chiu, Hem Takiar, Jack Chang Chien, Ning Liu |
2013-07-09 |
$9,880,000 |
| 8415808 |
Semiconductor device with die stack arrangement including staggered die and efficient wire bonding |
Chih-Chin Liao, Ya Huei Lee |
2013-04-09 |
$12,563,000 |
| 8349655 |
Method of fabricating a two-sided die in a four-sided leadframe based package |
Vani Verma, Hem Takiar |
2013-01-08 |
$7,183,000 |
| 8232145 |
Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards |
Che-Jung Chang, Chin-Tien Chiu, Hem Takiar, Jack Chang Chien, Ning Liu |
2012-07-31 |
$13,927,000 |
| 8217522 |
Printed circuit board with coextensive electrical connectors and contact pad areas |
Chih-Chin Liao, Han-Shiao Chen, Chin-Tien Chiu, Ken Jian Ming Wang, Hem Takiar |
2012-07-10 |
$9,150,000 |
| 8129272 |
Hidden plating traces |
Hem Takiar, Ken Jian Ming Wang, Chin-Tien Chiu, Han-Shiao Chen, Chih-Chin Liao |
2012-03-06 |
$7,698,000 |
| 8110439 |
Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages |
Chi-Chin Liao, Hem Takiar |
2012-02-07 |
$9,140,000 |
| 8053276 |
Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages |
Chi-Chin Liao, Hem Takiar |
2011-11-08 |
$12,674,000 |
| 8053880 |
Stacked, interconnected semiconductor package |
Chih-Chin Liao, Hem Takiar |
2011-11-08 |
$12,674,000 |