Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10229886 | Discrete component backward traceability and semiconductor device forward traceability | Didier Chavet | 2019-03-12 |
| 10051733 | Printed circuit board with coextensive electrical connectors and contact pad areas | Chih-Chin Liao, Han-Shiao Chen, Chin-Tien Chiu, Ken Jian Ming Wang, Hem Takiar | 2018-08-14 |
| 9773766 | Semiconductor device including independent film layer for embedding and/or spacing semiconductor die | Ning Ye, Chin-Tien Chiu, Suresh Upadhyayula, Peng-Fei Fu, Zhong Lu +7 more | 2017-09-26 |
| 9704797 | Waterfall wire bonding | Zhong Lu, Fen Yu, Chin-Tien Chiu, Fuqiang Xiao | 2017-07-11 |
| 9362244 | Wire tail connector for a semiconductor device | Chin-Tien Chiu, Hem Takiar | 2016-06-07 |
| 9337153 | EMI shielding and thermal dissipation for semiconductor device | Peng-Fei Fu, Shan Luo, Zhong Lu, Kaiyou Qian, Chin-Tien Chiu +2 more | 2016-05-10 |
| 9331045 | Semiconductor die laminating device with independent drives | Wei Gu, Zhong Lu, Chin-Tien Chiu, En-Yong Tai, Min Ni | 2016-05-03 |
| 9240393 | High yield semiconductor device | Zhong Lu, Gursharan Singh, Wei Gu | 2016-01-19 |
| 9236368 | Semiconductor device including embedded controller die and method of making same | Shiv Shankar Kumar, Chin-Tien Chiu, Kaiyou Qian | 2016-01-12 |
| 9230919 | Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging | Chin-Tien Chiu, Chih-Chin Liao, Ken Jian Ming Wang, Han-Shiao Chen, Hem Takiar | 2016-01-05 |
| 9209159 | Hidden plating traces | Hem Takiar, Ken Jian Ming Wang, Chin-Tien Chiu, Han-Shiao Chen, Chih-Chin Liao | 2015-12-08 |
| 8878368 | Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging | Chin-Tien Chiu, Chih-Chin Liao, Ken Jian Ming Wang, Han-Shiao Chen, Hem Takiar | 2014-11-04 |
| 8853863 | Semiconductor device with die stack arrangement including staggered die and efficient wire bonding | Chin-Chin Liao, Ya Huei Lee | 2014-10-07 |
| 8653653 | High density three dimensional semiconductor die package | Chih-Chin Liao, Hem Takiar | 2014-02-18 |
| 8502375 | Corrugated die edge for stacked die semiconductor package | Chih-Chin Liao | 2013-08-06 |
| 8482139 | Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards | Che-Jung Chang, Chin-Tien Chiu, Hem Takiar, Jack Chang Chien, Ning Liu | 2013-07-09 |
| 8415808 | Semiconductor device with die stack arrangement including staggered die and efficient wire bonding | Chih-Chin Liao, Ya Huei Lee | 2013-04-09 |
| 8349655 | Method of fabricating a two-sided die in a four-sided leadframe based package | Vani Verma, Hem Takiar | 2013-01-08 |
| 8232145 | Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards | Che-Jung Chang, Chin-Tien Chiu, Hem Takiar, Jack Chang Chien, Ning Liu | 2012-07-31 |
| 8217522 | Printed circuit board with coextensive electrical connectors and contact pad areas | Chih-Chin Liao, Han-Shiao Chen, Chin-Tien Chiu, Ken Jian Ming Wang, Hem Takiar | 2012-07-10 |
| 8129272 | Hidden plating traces | Hem Takiar, Ken Jian Ming Wang, Chin-Tien Chiu, Han-Shiao Chen, Chih-Chin Liao | 2012-03-06 |
| 8110439 | Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages | Chi-Chin Liao, Hem Takiar | 2012-02-07 |
| 8053276 | Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages | Chi-Chin Liao, Hem Takiar | 2011-11-08 |
| 8053880 | Stacked, interconnected semiconductor package | Chih-Chin Liao, Hem Takiar | 2011-11-08 |
| 7939944 | Semiconductor die having a redistribution layer | Chien-Ko Liao, Chin-Tien Chiu, Jack Chang Chien, Hem Takiar | 2011-05-10 |