CL

Chi-Chin Liao

ST Sandisk Technologies: 2 patents #967 of 2,224Top 45%
📍 Changhua City, TW: #303 of 984 inventorsTop 35%
Overall (All Time): #2,085,269 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
8110439 Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages Cheeman Yu, Hem Takiar 2012-02-07
8053276 Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages Cheeman Yu, Hem Takiar 2011-11-08