Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412827 | Semiconductor die package with conductive line crack prevention design | Shu-Shen Yeh, Kuo-Ching Hsu, Shyue-Ter Leu, Po-Yao Lin, Shin-Puu Jeng | 2025-09-09 |
| 11854956 | Semiconductor die package with conductive line crack prevention design | Shu-Shen Yeh, Kuo-Ching Hsu, Shyue-Ter Leu, Po-Yao Lin, Shin-Puu Jeng | 2023-12-26 |
| 8853863 | Semiconductor device with die stack arrangement including staggered die and efficient wire bonding | Chin-Chin Liao, Cheeman Yu | 2014-10-07 |
| 8415808 | Semiconductor device with die stack arrangement including staggered die and efficient wire bonding | Chih-Chin Liao, Cheeman Yu | 2013-04-09 |