Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051660 | Wire bond pad design for compact stacked-die package | Xuyi Yang, Cong Zhang, Kuo-Chien Wang, Chin-Tien Chiu | 2024-07-30 |
| 11189582 | Wire bond pad design for compact stacked-die package | Xuyi Yang, Cong Zhang, Kuo-Chien Wang, Chin-Tien Chiu | 2021-11-30 |
| 10177119 | Fan out semiconductor device including a plurality of semiconductor die | Cong Zhang, Bin Xu, Haijun Wu, Chin-Tien Chiu, Zengyu Zhou | 2019-01-08 |
| 9704797 | Waterfall wire bonding | Zhong Lu, Fen Yu, Chin-Tien Chiu, Cheeman Yu | 2017-07-11 |