Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051660 | Wire bond pad design for compact stacked-die package | Xuyi Yang, Fuqiang Xiao, Cong Zhang, Chin-Tien Chiu | 2024-07-30 |
| 11189582 | Wire bond pad design for compact stacked-die package | Xuyi Yang, Fuqiang Xiao, Cong Zhang, Chin-Tien Chiu | 2021-11-30 |