| 12051660 |
Wire bond pad design for compact stacked-die package |
Fuqiang Xiao, Cong Zhang, Kuo-Chien Wang, Chin-Tien Chiu |
2024-07-30 |
| 11456279 |
Integrated electronic element module, semiconductor package, and method for fabricating the same |
Cong Zhang, Chin-Tien Chiu, Qi Deng |
2022-09-27 |
| 11425817 |
Side contact pads for high-speed memory card |
Shineng Ma, Chih-Chin Liao, Chin-Tien Chiu, JinXiang Huang |
2022-08-23 |
| 11302673 |
Semiconductor device including vertically stacked semiconductor dies |
Cong Zhang, Chin-Tien Chiu |
2022-04-12 |
| 11276669 |
High capacity semiconductor device including bifurcated memory module |
Shineng Ma, Cong Zhang, Chin-Tien Chiu |
2022-03-15 |
| 11257785 |
Multi-module integrated interposer and semiconductor device formed therefrom |
Cong Zhang, Chin-Tien Chiu, Yazhou Zhang |
2022-02-22 |
| 11189582 |
Wire bond pad design for compact stacked-die package |
Fuqiang Xiao, Cong Zhang, Kuo-Chien Wang, Chin-Tien Chiu |
2021-11-30 |
| 11139277 |
Semiconductor device including contact fingers on opposed surfaces |
Chien-Te Chen, Cong Zhang, Hsiang Ju Huang, Yu Ying Tan, Han-Shiao Chen |
2021-10-05 |