Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021060 | Reducing keep-out-zone area for a semiconductor device | Kevin Du, Hope Chiu, Alex Zhang, Vincent Jiang, Shixing Zhu +3 more | 2024-06-25 |
| 12021061 | Packaged memory device with flip chip and wire bond dies | Rui Yuan, Hope Chiu, Paul Qu, Kevin Du, Yi-Hsuan Su +1 more | 2024-06-25 |
| 11917761 | Tombstone prevention for a surface mount device | Joyce Chen, Lynn Lin, Emma Wang, Linda Huang, Cong Zhang +1 more | 2024-02-27 |
| 11810896 | Substrate component layout and bonding method for increased package capacity | Jiandi Du, Rui Yuan, Fen Yu, Hope Chiu | 2023-11-07 |
| 11784135 | Semiconductor device including conductive bumps to improve EMI/RFI shielding | Jiandi Du, Binbin Zheng, Rui Guo, Chin-Tien Chiu, Fen Yu | 2023-10-10 |
| 11031378 | Semiconductor device including high speed heterogeneous integrated controller and cache | Yazhou Zhang, Chin-Tien Chiu | 2021-06-08 |
| 10236276 | Semiconductor device including vertically integrated groups of semiconductor packages | Yangming Liu, Chin-Tien Chiu, Zhongli Ji, Shaopeng Dong | 2019-03-19 |
| 10177119 | Fan out semiconductor device including a plurality of semiconductor die | Cong Zhang, Fuqiang Xiao, Bin Xu, Haijun Wu, Chin-Tien Chiu | 2019-01-08 |