Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12114435 | Surface mount technology method and magnetic carrier system | Virgil Zhu, Vincent Jiang, Shixing Zhu, Yuanheng Zhang, Enoch He +4 more | 2024-10-08 |
| 12021060 | Reducing keep-out-zone area for a semiconductor device | Kevin Du, Hope Chiu, Zengyu Zhou, Alex Zhang, Vincent Jiang +3 more | 2024-06-25 |
| 12021061 | Packaged memory device with flip chip and wire bond dies | Rui Yuan, Hope Chiu, Kevin Du, Zengyu Zhou, Yi-Hsuan Su +1 more | 2024-06-25 |
| 11837476 | Flip-chip package with reduced underfill area | Yazhou Zhang, Hope Chiu, Jiandi Du | 2023-12-05 |