Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021060 | Reducing keep-out-zone area for a semiconductor device | Kevin Du, Hope Chiu, Zengyu Zhou, Alex Zhang, Vincent Jiang +3 more | 2024-06-25 |
| 12021061 | Packaged memory device with flip chip and wire bond dies | Rui Yuan, Hope Chiu, Paul Qu, Kevin Du, Zengyu Zhou +1 more | 2024-06-25 |
| 11339417 | Amplifier system and controls for dielectrophoretic tracking in microfluidic devices | Nathan Swami, Cirle Alcantara Warren, Ali Rohani, Vahid Farmehini | 2022-05-24 |
| 7701056 | Redistribution connecting structure of solder balls | — | 2010-04-20 |