Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033958 | Semiconductor device including a suspended reinforcing layer and method of manufacturing same | Shenghua Huang, Bo Yang, Ning Ye, Cong Zhang | 2024-07-09 |
| 11985782 | Enclosure fitting for electronic device | Bo Yang, Warren Middlekauff, Sean Lau, Ning Ye, Shrikar Bhagath | 2024-05-14 |
| 11978713 | Flip chip bump with multi-PI opening | Shenghua Huang, Bo Yang, Ning Ye | 2024-05-07 |
| 11961778 | Semiconductor device package having multi-layer molding compound and method | Shenghua Huang, Bo Yang, Ning Ye | 2024-04-16 |
| 11393735 | Semiconductor device including reinforced corner supports | Ning Ye, Chin-Tien Chiu | 2022-07-19 |
| 11177239 | Semiconductor device including control switches to reduce pin capacitance | Shineng Ma, Chin-Tien Chiu, Chih-Chin Liao, Ye Bai, Yazhou Zhang +1 more | 2021-11-16 |
| 11177242 | Semiconductor device including magnetic hold-down layer | Ning Ye, Bo Yang | 2021-11-16 |
| 10854573 | Semiconductor die singulation using a sacrificial bonding material layer and an anisotropic channel etch | Zhongli Ji, Ning Ye, Tong Zhang, Hem Takiar | 2020-12-01 |
| 10236276 | Semiconductor device including vertically integrated groups of semiconductor packages | Chin-Tien Chiu, Zhongli Ji, Shaopeng Dong, Zengyu Zhou | 2019-03-19 |