| 12033958 |
Semiconductor device including a suspended reinforcing layer and method of manufacturing same |
Shenghua Huang, Bo Yang, Ning Ye, Cong Zhang |
2024-07-09 |
| 11985782 |
Enclosure fitting for electronic device |
Bo Yang, Warren Middlekauff, Sean Lau, Ning Ye, Shrikar Bhagath |
2024-05-14 |
| 11978713 |
Flip chip bump with multi-PI opening |
Shenghua Huang, Bo Yang, Ning Ye |
2024-05-07 |
| 11961778 |
Semiconductor device package having multi-layer molding compound and method |
Shenghua Huang, Bo Yang, Ning Ye |
2024-04-16 |
| 11393735 |
Semiconductor device including reinforced corner supports |
Ning Ye, Chin-Tien Chiu |
2022-07-19 |
| 11177239 |
Semiconductor device including control switches to reduce pin capacitance |
Shineng Ma, Chin-Tien Chiu, Chih-Chin Liao, Ye Bai, Yazhou Zhang +1 more |
2021-11-16 |
| 11177242 |
Semiconductor device including magnetic hold-down layer |
Ning Ye, Bo Yang |
2021-11-16 |
| 10854573 |
Semiconductor die singulation using a sacrificial bonding material layer and an anisotropic channel etch |
Zhongli Ji, Ning Ye, Tong Zhang, Hem Takiar |
2020-12-01 |
| 10236276 |
Semiconductor device including vertically integrated groups of semiconductor packages |
Chin-Tien Chiu, Zhongli Ji, Shaopeng Dong, Zengyu Zhou |
2019-03-19 |