| 12020997 |
Methods of forming semiconductor device packages having alignment marks on a carrier substrate |
Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Ching-Pin Yuan |
2024-06-25 |
| 11721598 |
Method of forming semiconductor device package having testing pads on an upper die |
Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Ching-Pin Yuan |
2023-08-08 |
| 11309223 |
Method of forming semiconductor device package having dummy devices on a first die |
Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Ching-Pin Yuan |
2022-04-19 |
| 11276958 |
Connector |
Xian Zhu |
2022-03-15 |
| 10672674 |
Method of forming semiconductor device package having testing pads on a topmost die |
Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Ching-Pin Yuan |
2020-06-02 |
| 10109132 |
Sampling method and sampling apparatus for anti-counterfeiting information about cash note |
Zhuwen Chen, Bihai Yuan |
2018-10-23 |
| 9469554 |
Bipolar electrode and supercapacitor desalination device, and methods of manufacture |
Liping Zheng, Hai Yang, Wei Cai, Jianyun Liu, Zhigang Deng +2 more |
2016-10-18 |
| 9127108 |
Method for making polymer, and associated polymer, membrane and electrode |
Zhigang Deng, Hai Yang, Liping Zheng, Su Lu, Lin Chen +2 more |
2015-09-08 |
| 8878346 |
Molded SiP package with reinforced solder columns |
Chin-Tien Chiu, Hem Takiar, Jiang Zhu, Jack Chang-Chien, Cheemen Yu |
2014-11-04 |
| 8641454 |
Electrical connector |
Hsin-Hsun Chen |
2014-02-04 |
| 8211335 |
Method for making polymer, coating electrode, and associated polymer and electrode |
Zhigang Deng, Hai Yang, Liping Zheng, Su Lu, Lin Chen +2 more |
2012-07-03 |
| 7435624 |
Method of reducing mechanical stress on a semiconductor die during fabrication |
Chin-Tien Chiu, Hem Takiar, Jiang hua Java Zhu, Jack Chang-Chien, Cheemen Yu |
2008-10-14 |
