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USPTO Patent Rankings Data through Dec 31, 2025
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Hui Liu — 12 Patents

GE: 3 patents #10,387 of 36,430Top 30%
STSandisk Technologies: 2 patents #1,216 of 2,594Top 50%
GCGrg Banking Equipment Co.: 1 patents #92 of 173Top 55%
MOMolex: 1 patents #940 of 1,726Top 55%
PCProconn Technology Co.: 1 patents #12 of 19Top 65%
Shanghai, CN: #1,006 of 19,267 inventorsTop 6%
Overall (All Time): #396,045 of 4,157,543Top 10%
12 Patents All Time
Hui Liu has been granted 12 US patents while listed as an inventor at GE. The first was granted in 2008 and the most recent in June 2024. Hui Liu ranks #396,045 of 4,157,543 US inventors in our database (top 9.5%). Patent records list Hui Liu in Shanghai, CN.

Patents per Year

Patents granted per year, 2008 to 2024Bar chart with a peak of 2 patents in 2014.peak 22008: 1 patents20082012: 1 patents20122014: 2 patents20142015: 1 patents20152016: 1 patents20162018: 1 patents20182020: 1 patents20202022: 2 patents20222023: 1 patents20232024: 1 patents2024

Issued Patents All Time

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12020997 Methods of forming semiconductor device packages having alignment marks on a carrier substrate Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Ching-Pin Yuan 2024-06-25 $10,883,000
11721598 Method of forming semiconductor device package having testing pads on an upper die Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Ching-Pin Yuan 2023-08-08 $7,870,000
11309223 Method of forming semiconductor device package having dummy devices on a first die Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Ching-Pin Yuan 2022-04-19 $10,829,000
11276958 Connector Xian Zhu 2022-03-15
10672674 Method of forming semiconductor device package having testing pads on a topmost die Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Ching-Pin Yuan 2020-06-02 $4,454,000
10109132 Sampling method and sampling apparatus for anti-counterfeiting information about cash note Zhuwen Chen, Bihai Yuan 2018-10-23
9469554 Bipolar electrode and supercapacitor desalination device, and methods of manufacture Liping Zheng, Hai Yang, Wei Cai, Jianyun Liu, Zhigang Deng +2 more 2016-10-18 $13,943,000
9127108 Method for making polymer, and associated polymer, membrane and electrode Zhigang Deng, Hai Yang, Liping Zheng, Su Lu, Lin Chen +2 more 2015-09-08 $16,151,000
8878346 Molded SiP package with reinforced solder columns Chin-Tien Chiu, Hem Takiar, Jiang Zhu, Jack Chang-Chien, Cheemen Yu 2014-11-04 $7,444,000
8641454 Electrical connector Hsin-Hsun Chen 2014-02-04
8211335 Method for making polymer, coating electrode, and associated polymer and electrode Zhigang Deng, Hai Yang, Liping Zheng, Su Lu, Lin Chen +2 more 2012-07-03 $18,351,000
7435624 Method of reducing mechanical stress on a semiconductor die during fabrication Chin-Tien Chiu, Hem Takiar, Jiang hua Java Zhu, Jack Chang-Chien, Cheemen Yu 2008-10-14 $7,352,000

Frequent Collaborators

Chen-Hua Yu4 shared
Ching-Pin Yuan4 shared
Sung-Feng Yeh4 shared
Hsien-Wei Chen4 shared
Ming-Fa Chen4 shared
Liping Zheng3 shared

Nearby-Ranked Inventors

John Patrick Hickey, III12
Gregory Lutter12
Josselin Xavier COUPARD12
Xuan Li12
Nandana Mihindukulasooriya12
Keiichi Matsuda12
Robert Imig12
Peter Mage12
Sze Ping Ching12