Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289395 | Aperture structure on semiconductor component backside to alleviate delamination in stacked packaging | Junrong Yan, Xin Lu | 2022-03-29 |
| 11177241 | Semiconductor device with top die positioned to reduce die cracking | Junrong Yan, Jianming Zhang, Min Zhao, Kailei Zhang, Kim Lee Bock | 2021-11-16 |
| 10483239 | Semiconductor device including dual pad wire bond interconnection | Junrong Yan, Xiaofeng Di, Harjashan Veer Singh, Gokul Kumar, Ming Xia Wu +1 more | 2019-11-19 |
| 10418334 | Semiconductor device including corner recess | Hang ZHANG, Weili Wang, Junrong Yan, Kim Lee Bock, Chong Un Tan +1 more | 2019-09-17 |
| 10283485 | Semiconductor device including conductive bump interconnections | Junrong Yan, Xiaofeng Di, Kim Lee Bock, Mingxia Wu | 2019-05-07 |
| 10128218 | Semiconductor device including die bond pads at a die edge | Junrong Yan, Chong Un Tan, Ming Xia Wu, Kim Lee Bock, Shrikar Bhagath | 2018-11-13 |
| 8946878 | Integrated circuit package-in-package system housing a plurality of stacked and offset integrated circuits and method of manufacture therefor | Jae Hak Yee, Yu Feng Feng, Frederick Cruz Santos | 2015-02-03 |
| 8901439 | Integrated circuit package system with window opening | Yu Feng Feng, Guo Qiang Shen | 2014-12-02 |
| 8541886 | Integrated circuit packaging system with via and method of manufacture thereof | — | 2013-09-24 |
| 8288860 | Memory device system with stacked packages | Yu Feng Feng, Wen Qu | 2012-10-16 |
| 8242607 | Integrated circuit package system with offset stacked die and method of manufacture thereof | — | 2012-08-14 |
| 8138017 | Integrated circuit package system with through semiconductor vias and method of manufacture thereof | — | 2012-03-20 |
| 8037918 | Pick-up heads and systems for die bonding and related applications | Ya Ping Wang, Jian Yang, Guo Qiang Shen | 2011-10-18 |
| 7989941 | Integrated circuit package system with support structure for die overhang | Guo Qiang Shen, Ya Ping Wang | 2011-08-02 |
| 7867821 | Integrated circuit package system with through semiconductor vias and method of manufacture thereof | — | 2011-01-11 |