Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12398454 | Fixed-position defect doping method for micro-nanostructure, and NV center sensor | Mengqi Wang, Haoyu Sun, Xiangyu Ye, Pei Yu, Hangyu Liu +3 more | 2025-08-26 |
| 11335648 | Semiconductor chip fabrication and packaging methods thereof | Li Hui Lu, Chun Chao Fei, Po Yuan Chiang | 2022-05-17 |
| 11320951 | Transparent conductive electrode of touch panel | Chih-Cheng Chuang, Tao Liu | 2022-05-03 |
| 10950525 | Fabrication method of packaging structure | Li Jin, Li Hui Lu, Chun Chao Fei, Po Yuan Chiang | 2021-03-16 |
| 10522479 | Semiconductor chip, and fabrication and packaging methods thereof | Li Hui Lu, Chun Chao Fei, Po Yuan Chiang | 2019-12-31 |
| 10446474 | Packaging structure and fabrication method thereof | Li Jin, Li Hui Lu, Chun Chao Fei, Po Yuan Chiang | 2019-10-15 |
| 8037918 | Pick-up heads and systems for die bonding and related applications | Jian Yang, Guo Qiang Shen, Chee Keong Chin | 2011-10-18 |
| 8035336 | Charger slipcover and handheld device | Yi-Feng Sun, Shih-Kuang Tsai | 2011-10-11 |
| 7989941 | Integrated circuit package system with support structure for die overhang | Chee Keong Chin, Guo Qiang Shen | 2011-08-02 |