Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11335648 | Semiconductor chip fabrication and packaging methods thereof | Li Hui Lu, Chun Chao Fei, Ya Ping Wang | 2022-05-17 |
| 10950525 | Fabrication method of packaging structure | Li Jin, Li Hui Lu, Chun Chao Fei, Ya Ping Wang | 2021-03-16 |
| 10658239 | Wafer dicing method | Lihui Lu, Chunchao Fei, Yaping Wang | 2020-05-19 |
| 10522479 | Semiconductor chip, and fabrication and packaging methods thereof | Li Hui Lu, Chun Chao Fei, Ya Ping Wang | 2019-12-31 |
| 10446474 | Packaging structure and fabrication method thereof | Li Jin, Li Hui Lu, Chun Chao Fei, Ya Ping Wang | 2019-10-15 |