Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11335648 | Semiconductor chip fabrication and packaging methods thereof | Chun Chao Fei, Po Yuan Chiang, Ya Ping Wang | 2022-05-17 |
| 10950525 | Fabrication method of packaging structure | Li Jin, Chun Chao Fei, Po Yuan Chiang, Ya Ping Wang | 2021-03-16 |
| 10522479 | Semiconductor chip, and fabrication and packaging methods thereof | Chun Chao Fei, Po Yuan Chiang, Ya Ping Wang | 2019-12-31 |
| 10446474 | Packaging structure and fabrication method thereof | Li Jin, Chun Chao Fei, Po Yuan Chiang, Ya Ping Wang | 2019-10-15 |
| 7767844 | Method for manufacturing diethylene triamine pentaacetic acid derivative | Te-Wei Lee, Chia-Hsi Yang, Yen-Sheng Ho, Shu-Ling Chen | 2010-08-03 |
| 6723278 | Method of laser casting copper-based composites | Jerry Ying Hsi Fuh, Yoke San Wong, Zhenda Chen, Gnian C. Lim | 2004-04-20 |
| 6652797 | Method for determining resin curing areas in an optical stereolithography process | Ying Kit Chew, Yoke San Wong, Ying His Jerry Fuh, Han Tong Loh, Yeh Ching Andrew Nee +5 more | 2003-11-25 |
| 6621039 | Method and apparatus for creating a free-form three-dimensional metal part using high-temperature direct laser melting | Xinhua Wang, YunGan Wang, Kuak Choi Lealic Lim, Ying Hsi Jerry Fuh, Yoke San Wong +6 more | 2003-09-16 |