Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8901439 | Integrated circuit package system with window opening | Chee Keong Chin, Yu Feng Feng | 2014-12-02 |
| 8581382 | Integrated circuit packaging system with leadframe and method of manufacture thereof | Jae Hak Yee, Feng Yao | 2013-11-12 |
| 8207015 | Integrated circuit packaging system with package-on-package and method of manufacture thereof | Jae Hak Yee, Denver Zhu | 2012-06-26 |
| 8037918 | Pick-up heads and systems for die bonding and related applications | Ya Ping Wang, Jian Yang, Chee Keong Chin | 2011-10-18 |
| 7989941 | Integrated circuit package system with support structure for die overhang | Chee Keong Chin, Ya Ping Wang | 2011-08-02 |