Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8946878 | Integrated circuit package-in-package system housing a plurality of stacked and offset integrated circuits and method of manufacture therefor | Chee Keong Chin, Jae Hak Yee, Frederick Cruz Santos | 2015-02-03 |
| 8901439 | Integrated circuit package system with window opening | Chee Keong Chin, Guo Qiang Shen | 2014-12-02 |
| 8288860 | Memory device system with stacked packages | Chee Keong Chin, Wen Qu | 2012-10-16 |