Issued Patents All Time
Showing 1–25 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7667338 | Package with solder-filled via holes in molding layers | Chi-Shih Chang | 2010-02-23 |
| 7408253 | Chip-embedded support-frame board wrapped by folded flexible circuit for multiplying packing density | — | 2008-08-05 |
| 6992001 | Screen print under-bump metalization (UBM) to produce low cost flip chip substrate | — | 2006-01-31 |
| 6784556 | Design of interconnection pads with separated probing and wire bonding regions | — | 2004-08-31 |
| 6677668 | Configuration for testing a substrate mounted with a most performance-demanding integrated circuit | — | 2004-01-13 |
| 6369451 | Solder balls and columns with stratified underfills on substrate for flip chip joining | — | 2002-04-09 |
| 6301121 | Direct-chip-attach (DCA) multiple chip module (MCM) with repair-chip ready site to simplify assembling and testing process | — | 2001-10-09 |
| 6249052 | Substrate on chip (SOC) multiple-chip module (MCM) with chip-size-package (CSP) ready configuration | — | 2001-06-19 |
| 6093969 | Face-to-face (FTF) stacked assembly of substrate-on-bare-chip (SOBC) modules | — | 2000-07-25 |
| 6002178 | Multiple chip module configuration to simplify testing process and reuse of known-good chip-size package (CSP) | — | 1999-12-14 |
| 5508556 | Leaded semiconductor device having accessible power supply pad terminals | — | 1996-04-16 |
| 5468999 | Liquid encapsulated ball grid array semiconductor device with fine pitch wire bonding | Michael B. McShane | 1995-11-21 |
| 5450283 | Thermally enhanced semiconductor device having exposed backside and method for making the same | Michael B. McShane | 1995-09-12 |
| 5436203 | Shielded liquid encapsulated semiconductor device and method for making the same | — | 1995-07-25 |
| 5378657 | Method for making an aluminum clad leadframe and a semiconductor device employing the same | — | 1995-01-03 |
| 5329159 | Semiconductor device employing an aluminum clad leadframe | — | 1994-07-12 |
| 5329158 | Surface mountable semiconductor device having self loaded solder joints | — | 1994-07-12 |
| 5300187 | Method of removing contaminants | Israel A. Lesk, Young Limb, Philip J. Tobin, John G. Franka, Jonathan C. Dahm +2 more | 1994-04-05 |
| 5280193 | Repairable semiconductor multi-package module having individualized package bodies on a PC board substrate | James W. Sloan | 1994-01-18 |
| 5273938 | Method for attaching conductive traces to plural, stacked, encapsulated semiconductor die using a removable transfer film | Michael B. McShane | 1993-12-28 |
| 5258648 | Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery | — | 1993-11-02 |
| 5247423 | Stacking three dimensional leadless multi-chip module and method for making the same | Michael B. McShane | 1993-09-21 |
| 5239198 | Overmolded semiconductor device having solder ball and edge lead connective structure | Michael B. McShane | 1993-08-24 |
| 5222014 | Three-dimensional multi-chip pad array carrier | — | 1993-06-22 |
| 5219117 | Method of transferring solder balls onto a semiconductor device | — | 1993-06-15 |