Issued Patents All Time
Showing 26–44 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5216278 | Semiconductor device having a pad array carrier package | Michael B. McShane, Howard P. Wilson | 1993-06-01 |
| 5216283 | Semiconductor device having an insertable heat sink and method for mounting the same | — | 1993-06-01 |
| 5200362 | Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film | Michael B. McShane, Sugio Uchida, Takehi Sato | 1993-04-06 |
| 5157480 | Semiconductor device having dual electrical contact sites | Michael B. McShane | 1992-10-20 |
| 5114880 | Method for fabricating multiple electronic devices within a single carrier structure | — | 1992-05-19 |
| 5053357 | Method of aligning and mounting an electronic device on a printed circuit board using a flexible substrate having fixed lead arrays thereon | Michael B. McShane | 1991-10-01 |
| 5049526 | Method for fabricating semiconductor device including package | Michael B. McShane | 1991-09-17 |
| 5045914 | Plastic pad array electronic AC device | James J. Casto, Michael B. McShane | 1991-09-03 |
| 5045921 | Pad array carrier IC device using flexible tape | Howard P. Wilson | 1991-09-03 |
| 5036381 | Multiple electronic devices within a single carrier structure | — | 1991-07-30 |
| 5018005 | Thin, molded, surface mount electronic device | Michael B. McShane | 1991-05-21 |
| 5012386 | High performance overmolded electronic package | Michael B. McShane | 1991-04-30 |
| 5006922 | Packaged semiconductor device having a low cost ceramic PGA package | Michael B. McShane, Howard P. Wilson | 1991-04-09 |
| 4897602 | Electronic device package with peripheral carrier structure of low-cost plastic | Michael B. McShane, Charles G. Bigler, John A. Goertz, Joan M. Hamilton | 1990-01-30 |
| 4837184 | Process of making an electronic device package with peripheral carrier structure of low-cost plastic | Michael B. McShane, Charles G. Bigler, John A. Goertz | 1989-06-06 |
| 4791075 | Process for making a hermetic low cost pin grid array package | — | 1988-12-13 |
| 4672421 | Semiconductor packaging and method | — | 1987-06-09 |
| 4661887 | Surface mountable integrated circuit packages having solder bearing leads | — | 1987-04-28 |
| 4380866 | Method of programming ROM by offset masking of selected gates | Roger S. Countryman, Jr. | 1983-04-26 |