Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8168344 | Air-cooled thermal management for a fuel cell stack | Zakiul Kabir, Qimin Ming, Yang Song | 2012-05-01 |
| 7105245 | Fluid cell system reactant supply and effluent storage cartridges | Leroy Ohlsen, Steven Tallman | 2006-09-12 |
| 6642046 | Method and apparatus for performing biological reactions on a substrate surface | Mark McGarry, Peter Kahn, Todd Tuggle | 2003-11-04 |
| 6589778 | Method and apparatus for performing biological reactions on a substrate surface | — | 2003-07-08 |
| 6569674 | Method and apparatus for performing biological reactions on a substrate surface | Mark McGarry, W. Travis Johnson | 2003-05-27 |
| 6300679 | Flexible substrate for packaging a semiconductor component | Prosanto K. Mukerji, Ronald E. Thomas, Rajesh Srinivasan, Colin B. Bosch, James H. Knapp +2 more | 2001-10-09 |
| 5904955 | Encapsulation means and method | Robert Goldstein, Nikolai Osipenko | 1999-05-18 |
| 5860210 | Method of manufacturing an electronic component | — | 1999-01-19 |
| 5756380 | Method for making a moisture resistant semiconductor device having an organic substrate | Howard M. Berg, Sankaranarayanan Ganesan, Gary Lewis, James W. Sloan, Scott C. Bolton | 1998-05-26 |
| 5747858 | Electronic component having an interconnect substrate adjacent to a side surface of a device substrate | — | 1998-05-05 |
| 5556793 | Method of making a structure for top surface gettering of metallic impurities | Steven J. Adler, Israel A. Lesk, Peter L. Pegler, Hassan Pirastehfar | 1996-09-17 |
| 5385869 | Semiconductor chip bonded to a substrate and method of making | Jay Liu, Howard M. Berg | 1995-01-31 |
| 5145633 | Blow molding a container having three handles | — | 1992-09-08 |
| 5119171 | Semiconductor die having rounded or tapered edges and corners | Israel A. Lesk, Ronald E. Thomas | 1992-06-02 |
| 5103905 | Method of optimizing the conductivity of a propped fractured formation | Harold Dean Brannon, Janet Gulbis, Milton T. King | 1992-04-14 |
| 4989069 | Semiconductor package having leads that break-away from supports | — | 1991-01-29 |
| 4928162 | Die corner design having topological configurations | Israel A. Lesk, Ronald E. Thomas, James M. Rugg | 1990-05-22 |
| 4924291 | Flagless semiconductor package | Israel A. Lesk, Ronald E. Thomas, William L. Hunter, James J. Casto, Michael B. McShane | 1990-05-08 |
| 4872088 | Radial mounting for stacked wafer modules with cooling | — | 1989-10-03 |
| 4832996 | Semiconductor die for plastic encapsulation having an adhesion promoter | Israel A. Lesk, Ronald E. Thomas | 1989-05-23 |
| 4740868 | Rail bonded multi-chip leadframe, method and package | — | 1988-04-26 |