Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7074627 | Lead solder indicator and method | Thomas H. Koschmieder | 2006-07-11 |
| 7067907 | Semiconductor package having angulated interconnect surfaces | Thomas H. Koschmieder | 2006-06-27 |
| 6552436 | Semiconductor device having a ball grid array and method therefor | Thomas H. Koschmieder, Andrew Jefferson Mawer | 2003-04-22 |
| 6117759 | Method for multiplexed joining of solder bumps to various substrates during assembly of an integrated circuit package | Stuart E. Greer, David B. Clegg | 2000-09-12 |
| 5956606 | Method for bumping and packaging semiconductor die | — | 1999-09-21 |