Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Solder mass having conductive encapsulating arrangement

Solder mass having conductive encapsulating arrangement

US Patent 5130779 · Granted Jul 14, 1992

Estimated economic value: $13,053,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Utility-scale wave energy converters2025
Minimizing movements of offshore wind turbines2024
Multilayer pillar for reduced stress interconnect and method of making same2022
Multilayer pillar for reduced stress interconnect and method of making same2021
Multilayer pillar for reduced stress interconnect and method of making same2021
Multilayer pillar for reduced stress interconnect and method of making same2019
Multilayer pillar for reduced stress interconnect and method of making same2019
Multilayer pillar for reduced stress interconnect and method of making same2017
Multilayer pillar for reduced stress interconnect and method of making same2016
Method of fabricating printed circuit boards2016
Multilayer pillar for reduced stress interconnect and method of making same2015
Additives for grain fragmentation in Pb-free Sn-based solder2014