| 11967548 |
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly |
Thomas J. Brunschwiler, Bruno Michel |
2024-04-23 |
$9,522,000 |
| 10622294 |
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly |
Thomas J. Brunschwiler, Bruno Michel |
2020-04-14 |
$1,668,000 |
| 10586760 |
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly |
Thomas J. Brunschwiler, Bruno Michel |
2020-03-10 |
$1,254,000 |
| 9905506 |
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly |
Thomas J. Brunschwiler, Bruno Michel |
2018-02-27 |
$3,821,000 |
| 9905505 |
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly |
Thomas J. Brunschwiler, Bruno Michel |
2018-02-27 |
$3,821,000 |
| 9496981 |
System and method of masking electromagnetic interference (EMI) emissions of a circuit |
Sebastian T. Ventrone |
2016-11-15 |
$8,353,000 |
| 9301424 |
Auto-compensating temperature valve controller for electro-rheological fluid micro-channel cooled integrated circuit |
Kenneth J. Goodnow, Clarence R. Ogilvie, John Sargis, Jr., Sebastian T. Ventrone, Charles S. Woodruff |
2016-03-29 |
$2,226,000 |
| 9264150 |
Reactive metal optical security device and methods of fabrication and use |
Kenneth J. Goodnow, Clarence R. Ogilvie, Charles S. Woodruff, Sebastian T. Ventrone |
2016-02-16 |
$417,000 |
| 9257366 |
Auto-compensating temperature valve controller for electro-rheological fluid micro-channel cooled integrated circuit |
Kenneth J. Goodnow, Clarence R. Ogilvie, John Sargis, Jr., Sebastian T. Ventrone, Charles S. Woodruff |
2016-02-09 |
$2,307,000 |
| 9252071 |
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly |
Thomas J. Brunschwiler, Bruno Michel |
2016-02-02 |
$1,325,000 |
| 9252072 |
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly |
Thomas J. Brunschwiler, Bruno Michel |
2016-02-02 |
$1,325,000 |
| 9082875 |
Methods for normalizing strain in semicondcutor devices and strain normalized semiconductor devices |
Bruce Balch, John J. Ellis-Monaghan, Nazmul Habib |
2015-07-14 |
$7,900,000 |
| 9075106 |
Detecting chip alterations with light emission |
James A. Culp, David F. Heidel, Dirk Pfeiffer, Anthony D. Polson, Peilin Song +2 more |
2015-07-07 |
$5,899,000 |
| 9052724 |
Electro-rheological micro-channel anisotropic cooled integrated circuits and methods thereof |
Kenneth J. Goodnow, Clarence R. Ogilvie |
2015-06-09 |
$3,292,000 |
| 8853007 |
In-plane silicon heat spreader and method therefor |
Sri M. Sri-Jayantha |
2014-10-07 |
$3,450,000 |
| 8736353 |
Power supply for localized portions of an integrated circuit |
— |
2014-05-27 |
$4,024,000 |
| 8729549 |
Test structure and methodology for three-dimensional semiconductor structures |
Jerome L. Cann, Christopher McCall Durham, Paul D. Kartschoke, Peter Juergen Klim, Donald L. Wheater |
2014-05-20 |
$10,035,000 |
| 8686559 |
Semiconductor chip stacking for redundancy and yield improvement |
Philip G. Emma, Michael Ignatowski |
2014-04-01 |
$5,095,000 |
| 8689152 |
Double-sided integrated circuit chips |
Timothy J. Dalton, Jeffrey P. Gambino, Mark D. Jaffe, Paul D. Kartschoke, Stephen E. Luce +1 more |
2014-04-01 |
$5,095,000 |
| 8629554 |
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly |
Thomas J. Brunschwiler, Bruno Michel |
2014-01-14 |
$7,408,000 |
| 8597960 |
Semiconductor chip stacking for redundancy and yield improvement |
Philip G. Emma, Michael Ignatowski |
2013-12-03 |
$7,507,000 |
| 8575964 |
Inactivity triggered self clocking logic family |
Kenneth J. Goodnow, Clarence R. Ogilvie, John Sargis, Jr., Sebastian T. Ventrone, Charles S. Woodruff |
2013-11-05 |
$5,290,000 |
| 8576599 |
Multi-wafer 3D CAM cell |
Jagreet S. Atwal, Joseph S. Barnes, Robert J. Bucki, Jason A. Cox |
2013-11-05 |
$5,290,000 |
| 8569803 |
BEOL compatible FET structrure |
Christy S. Tyberg, Katherine L. Saenger, Jack O. Chu, Harold J. Hovel, Robert L. Wisnieff +1 more |
2013-10-29 |
$6,299,000 |
| 8513791 |
Compact multi-port CAM cell implemented in 3D vertical integration |
Robert J. Bucki, Jagreet S. Atwal, Joseph S. Barnes, Eric F. Robinson |
2013-08-20 |
$3,918,000 |
