Issued Patents All Time
Showing 25 most recent of 143 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11967548 | Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly | Thomas J. Brunschwiler, Bruno Michel | 2024-04-23 |
| 10622294 | Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly | Thomas J. Brunschwiler, Bruno Michel | 2020-04-14 |
| 10586760 | Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly | Thomas J. Brunschwiler, Bruno Michel | 2020-03-10 |
| 9905506 | Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly | Thomas J. Brunschwiler, Bruno Michel | 2018-02-27 |
| 9905505 | Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly | Thomas J. Brunschwiler, Bruno Michel | 2018-02-27 |
| 9496981 | System and method of masking electromagnetic interference (EMI) emissions of a circuit | Sebastian T. Ventrone | 2016-11-15 |
| 9301424 | Auto-compensating temperature valve controller for electro-rheological fluid micro-channel cooled integrated circuit | Kenneth J. Goodnow, Clarence R. Ogilvie, John Sargis, Jr., Sebastian T. Ventrone, Charles S. Woodruff | 2016-03-29 |
| 9264150 | Reactive metal optical security device and methods of fabrication and use | Kenneth J. Goodnow, Clarence R. Ogilvie, Charles S. Woodruff, Sebastian T. Ventrone | 2016-02-16 |
| 9257366 | Auto-compensating temperature valve controller for electro-rheological fluid micro-channel cooled integrated circuit | Kenneth J. Goodnow, Clarence R. Ogilvie, John Sargis, Jr., Sebastian T. Ventrone, Charles S. Woodruff | 2016-02-09 |
| 9252071 | Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly | Thomas J. Brunschwiler, Bruno Michel | 2016-02-02 |
| 9252072 | Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly | Thomas J. Brunschwiler, Bruno Michel | 2016-02-02 |
| 9082875 | Methods for normalizing strain in semicondcutor devices and strain normalized semiconductor devices | Bruce Balch, John J. Ellis-Monaghan, Nazmul Habib | 2015-07-14 |
| 9075106 | Detecting chip alterations with light emission | James A. Culp, David F. Heidel, Dirk Pfeiffer, Anthony D. Polson, Peilin Song +2 more | 2015-07-07 |
| 9052724 | Electro-rheological micro-channel anisotropic cooled integrated circuits and methods thereof | Kenneth J. Goodnow, Clarence R. Ogilvie | 2015-06-09 |
| 8853007 | In-plane silicon heat spreader and method therefor | Sri M. Sri-Jayantha | 2014-10-07 |
| 8736353 | Power supply for localized portions of an integrated circuit | — | 2014-05-27 |
| 8729549 | Test structure and methodology for three-dimensional semiconductor structures | Jerome L. Cann, Christopher McCall Durham, Paul D. Kartschoke, Peter Juergen Klim, Donald L. Wheater | 2014-05-20 |
| 8686559 | Semiconductor chip stacking for redundancy and yield improvement | Philip G. Emma, Michael Ignatowski | 2014-04-01 |
| 8689152 | Double-sided integrated circuit chips | Timothy J. Dalton, Jeffrey P. Gambino, Mark D. Jaffe, Paul D. Kartschoke, Stephen E. Luce +1 more | 2014-04-01 |
| 8629554 | Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly | Thomas J. Brunschwiler, Bruno Michel | 2014-01-14 |
| 8597960 | Semiconductor chip stacking for redundancy and yield improvement | Philip G. Emma, Michael Ignatowski | 2013-12-03 |
| 8576599 | Multi-wafer 3D CAM cell | Jagreet S. Atwal, Joseph S. Barnes, Robert J. Bucki, Jason A. Cox | 2013-11-05 |
| 8575964 | Inactivity triggered self clocking logic family | Kenneth J. Goodnow, Clarence R. Ogilvie, John Sargis, Jr., Sebastian T. Ventrone, Charles S. Woodruff | 2013-11-05 |
| 8569803 | BEOL compatible FET structrure | Christy S. Tyberg, Katherine L. Saenger, Jack O. Chu, Harold J. Hovel, Robert L. Wisnieff +1 more | 2013-10-29 |
| 8513791 | Compact multi-port CAM cell implemented in 3D vertical integration | Robert J. Bucki, Jagreet S. Atwal, Joseph S. Barnes, Eric F. Robinson | 2013-08-20 |