Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
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Sean Smith — 8 Patents

IBM: 8 patents #13,181 of 70,183Top 20%
Hopewell Junction, NY: #185 of 648 inventorsTop 30%
New York: #18,190 of 115,490 inventorsTop 20%
Overall (All Time): #600,572 of 4,157,543Top 15%
8 Patents All Time
Sean Smith has been granted 8 US patents while listed as an inventor at IBM. The first was granted in 2005 and the most recent in January 2011. Sean Smith ranks #600,572 of 4,157,543 US inventors in our database (top 14.4%). Patent records list Sean Smith in Hopewell Junction, NY, US.

Patents per Year

Patents granted per year, 2005 to 2011Bar chart with a peak of 3 patents in 2006.peak 32005: 1 patents20052006: 3 patents20062007: 1 patents20072008: 1 patents20082009: 1 patents20092011: 1 patents2011

Issued Patents All Time

Showing 1–8 of 8 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
7867897 Low leakage metal-containing cap process using oxidation Jeffrey P. Gambino, Jason P. Gill, Jean Wynne 2011-01-11 $2,856,000
7598614 Low leakage metal-containing cap process using oxidation Jeffrey P. Gambino, Jason P. Gill, Jean Wynne 2009-10-06 $19,573,000
7407605 Manufacturable CoWP metal cap process for copper interconnects Darryl D. Restaino, Donald F. Canaperi, Judith M. Rubino, Richard O. Henry, James E. Fluegel +1 more 2008-08-05 $7,485,000
7253106 Manufacturable CoWP metal cap process for copper interconnects Darryl D. Restaino, Donald F. Canaperi, Judith M. Rubino, Richard O. Henry, James E. Fluegel +1 more 2007-08-07 $6,917,000
7064064 Copper recess process with application to selective capping and electroless plating Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Fen F. Jamin +11 more 2006-06-20 $5,983,000
7045453 Very low effective dielectric constant interconnect structures and methods for fabricating the same Donald F. Canaperi, Timothy J. Dalton, Stephen M. Gates, Mahadevaiyer Krishnan, Satya V. Nitta +1 more 2006-05-16 $5,914,000
7023093 Very low effective dielectric constant interconnect Structures and methods for fabricating the same Donald F. Canaperi, Timothy J. Dalton, Stephen M. Gates, Mahadevaiyer Krishnan, Satya V. Nitta +1 more 2006-04-04 $10,598,000
6975032 Copper recess process with application to selective capping and electroless plating Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Fen F. Jamin +11 more 2005-12-13 $5,273,000