Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8345433 | Heterogeneous organic laminate stack ups for high frequency applications | Sidharth Dalmia, Venkatesh Sundaram, Madhavan Swaminathan | 2013-01-01 |
| 8013688 | Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications | Madhavan Swaminathan, Venkatesh Sundaram, Sidharth Dalmia | 2011-09-06 |
| 7989895 | Integration using package stacking with multi-layer organic substrates | Sidharth Dalmia | 2011-08-02 |
| 7874519 | Spacecraft three-axis attitude acquisition from sun direction measurement | Bruce Brumfield, Xenophon Price, Philip Conway Hirschberg, Kam Chan | 2011-01-25 |
| 7805834 | Method for fabricating three-dimensional all organic interconnect structures | Madhavan Swaminathan, Venkatesh Sundaram, Sidharth Dalmia | 2010-10-05 |
| 7808434 | Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices | Sidharth Dalmia | 2010-10-05 |
| 7795995 | Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications | Madhavan Swaminathan, Venkatesh Sundaram, Sidharth Dalmia | 2010-09-14 |
| 7489914 | Multi-band RF transceiver with passive reuse in organic substrates | Vinu Govind, Sidharth Dalmia, Amit Bavisi, Venkatesh Sundraram, Madhavan Swaminathan | 2009-02-10 |
| 7439840 | Methods and apparatuses for high-performing multi-layer inductors | Lawrence A. Carastro, Semyon Lapushin, Sidharth Dalmia, Winston Czakon | 2008-10-21 |
| 7260890 | Methods for fabricating three-dimensional all organic interconnect structures | Madhavan Swaminathan, Venkatesh Sundaram, Sidharth Dalmia | 2007-08-28 |
| 7068124 | Integrated passive devices fabricated utilizing multi-layer, organic laminates | Madhavan Swaminathan, Venkatesh Sundaram, Sidharth Dalmia | 2006-06-27 |
| 6987307 | Stand-alone organic-based passive devices | Madhavan Swaminathan, Venkatesh Sundaram, Sidharth Dalmia | 2006-01-17 |
| 6900708 | Integrated passive devices fabricated utilizing multi-layer, organic laminates | Madhavan Swaminathan, Venkatesh Sundaram, Sidharth Dalmia | 2005-05-31 |
| 6444919 | Thin film wiring scheme utilizing inter-chip site surface wiring | Laertis Economikos, Mukta S. Farooq, Michael F. McAllister, Eric D. Perfecto, Chandrika Prasad +3 more | 2002-09-03 |
| 6225035 | Method for forming a thick-film resistor | Min-Xian Zhang, Vernon L. Brown, Lola Conway | 2001-05-01 |
| 5916451 | Minimal capture pads applied to ceramic vias in ceramic substrates | Eric D. Perfecto, Chandrika Prasad, Keshav Prasad, Gordon J. Robbins, Madhavan Swaminathan | 1999-06-29 |
| 5898222 | Capped copper electrical interconnects | Mukta S. Farooq, Suryanarayana Kaja, Eric D. Perfecto | 1999-04-27 |
| 5757079 | Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages and the resulting MLTF structure | Michael F. McAllister, James A. McDonald, Eric D. Perfecto, Chandrika Prasad, Keshav Prasad +2 more | 1998-05-26 |
| 5747095 | Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages | Michael F. McAllister, Eric D. Perfecto, James A. McDonald, Keshav Prasad, Gordon J. Robbins +2 more | 1998-05-05 |
| 5705857 | Capped copper electrical interconnects | Mukta S. Farooq, Suryanarayana Kaja, Eric D. Perfecto | 1998-01-06 |
| 5549808 | Method for forming capped copper electrical interconnects | Mukta S. Farooq, Suryanarayana Kaja, Eric D. Perfecto | 1996-08-27 |
| 5545927 | Capped copper electrical interconnects | Mukta S. Farooq, Suryanarayana Kaja, Eric D. Perfecto | 1996-08-13 |
| 5534466 | Method of making area direct transfer multilayer thin film structure | Eric D. Perfecto, Chandrika Prasad, Kwong Hon Wong | 1996-07-09 |
| 5483105 | Module input-output pad having stepped set-back | Suryanarayana Kaja, Eric D. Perfecto, William H. Price, Sampath Purushothaman, Srinivasa N. Reddy +1 more | 1996-01-09 |
| 5464682 | Minimal capture pads applied to ceramic vias in ceramic substrates | Eric D. Perfecto, Chandrika Prasad, Keshav Prasad, Gordon J. Robbins, Madhavan Swaminathan | 1995-11-07 |