| 8345433 |
Heterogeneous organic laminate stack ups for high frequency applications |
Sidharth Dalmia, Venkatesh Sundaram, Madhavan Swaminathan |
2013-01-01 |
|
| 8013688 |
Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications |
Madhavan Swaminathan, Venkatesh Sundaram, Sidharth Dalmia |
2011-09-06 |
|
| 7989895 |
Integration using package stacking with multi-layer organic substrates |
Sidharth Dalmia |
2011-08-02 |
|
| 7874519 |
Spacecraft three-axis attitude acquisition from sun direction measurement |
Bruce Brumfield, Xenophon Price, Philip Conway Hirschberg, Kam Chan |
2011-01-25 |
|
| 7808434 |
Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices |
Sidharth Dalmia |
2010-10-05 |
$9,701,000 |
| 7805834 |
Method for fabricating three-dimensional all organic interconnect structures |
Madhavan Swaminathan, Venkatesh Sundaram, Sidharth Dalmia |
2010-10-05 |
|
| 7795995 |
Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications |
Madhavan Swaminathan, Venkatesh Sundaram, Sidharth Dalmia |
2010-09-14 |
|
| 7489914 |
Multi-band RF transceiver with passive reuse in organic substrates |
Vinu Govind, Sidharth Dalmia, Amit Bavisi, Venkatesh Sundraram, Madhavan Swaminathan |
2009-02-10 |
|
| 7439840 |
Methods and apparatuses for high-performing multi-layer inductors |
Lawrence A. Carastro, Semyon Lapushin, Sidharth Dalmia, Winston Czakon |
2008-10-21 |
|
| 7260890 |
Methods for fabricating three-dimensional all organic interconnect structures |
Madhavan Swaminathan, Venkatesh Sundaram, Sidharth Dalmia |
2007-08-28 |
|
| 7068124 |
Integrated passive devices fabricated utilizing multi-layer, organic laminates |
Madhavan Swaminathan, Venkatesh Sundaram, Sidharth Dalmia |
2006-06-27 |
|
| 6987307 |
Stand-alone organic-based passive devices |
Madhavan Swaminathan, Venkatesh Sundaram, Sidharth Dalmia |
2006-01-17 |
|
| 6900708 |
Integrated passive devices fabricated utilizing multi-layer, organic laminates |
Madhavan Swaminathan, Venkatesh Sundaram, Sidharth Dalmia |
2005-05-31 |
|
| 6444919 |
Thin film wiring scheme utilizing inter-chip site surface wiring |
Laertis Economikos, Mukta S. Farooq, Michael F. McAllister, Eric D. Perfecto, Chandrika Prasad +3 more |
2002-09-03 |
$9,688,000 |
| 6225035 |
Method for forming a thick-film resistor |
Min-Xian Zhang, Vernon L. Brown, Lola Conway |
2001-05-01 |
$27,264,000 |
| 5916451 |
Minimal capture pads applied to ceramic vias in ceramic substrates |
Eric D. Perfecto, Chandrika Prasad, Keshav Prasad, Gordon J. Robbins, Madhavan Swaminathan |
1999-06-29 |
$36,828,000 |
| 5898222 |
Capped copper electrical interconnects |
Mukta S. Farooq, Suryanarayana Kaja, Eric D. Perfecto |
1999-04-27 |
$19,884,000 |
| 5757079 |
Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages and the resulting MLTF structure |
Michael F. McAllister, James A. McDonald, Eric D. Perfecto, Chandrika Prasad, Keshav Prasad +2 more |
1998-05-26 |
$6,589,000 |
| 5747095 |
Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages |
Michael F. McAllister, Eric D. Perfecto, James A. McDonald, Keshav Prasad, Gordon J. Robbins +2 more |
1998-05-05 |
$15,329,000 |
| 5705857 |
Capped copper electrical interconnects |
Mukta S. Farooq, Suryanarayana Kaja, Eric D. Perfecto |
1998-01-06 |
$19,122,000 |
| 5549808 |
Method for forming capped copper electrical interconnects |
Mukta S. Farooq, Suryanarayana Kaja, Eric D. Perfecto |
1996-08-27 |
$10,770,000 |
| 5545927 |
Capped copper electrical interconnects |
Mukta S. Farooq, Suryanarayana Kaja, Eric D. Perfecto |
1996-08-13 |
$8,302,000 |
| 5534466 |
Method of making area direct transfer multilayer thin film structure |
Eric D. Perfecto, Chandrika Prasad, Kwong Hon Wong |
1996-07-09 |
$6,020,000 |
| 5483105 |
Module input-output pad having stepped set-back |
Suryanarayana Kaja, Eric D. Perfecto, William H. Price, Sampath Purushothaman, Srinivasa N. Reddy +1 more |
1996-01-09 |
$10,524,000 |
| 5464682 |
Minimal capture pads applied to ceramic vias in ceramic substrates |
Eric D. Perfecto, Chandrika Prasad, Keshav Prasad, Gordon J. Robbins, Madhavan Swaminathan |
1995-11-07 |
$7,474,000 |
