Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of making area direct transfer multilayer thin film structure

Method of making area direct transfer multilayer thin film structure

US Patent 5534466 · Granted Jul 9, 1996

Estimated economic value: $6,020,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Resist patterned redistribution wiring on copper polyimide via layer2025
Infrared debond damage mitigation by copper fill pattern2025
Chip-to-chip and chip-to-substrate interconnections in multi-chip semiconductor 2019
Electrodeposition systems and methods that minimize anode and/or plating solutio2018
Structure for establishing interconnects in packages using thin interposers2018
Semiconductor device contact structure having stacked nickel, copper, and tin la2017
Non-transparent microelectronic grade glass as a substrate, temporary carrier or2017
Electrodeposition systems and methods that minimize anode and/or plating solutio2017
Method for establishing interconnects in packages using thin interposers2017
Silver alloying post-chip join2017
Multilayered contact structure having nickel, copper, and nickel-iron layers2016
Electromigration-resistant lead-free solder interconnect structures2016