Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integration using package stacking with multi-layer organic substrates

Integration using package stacking with multi-layer organic substrates

US Patent 7989895 · Granted Aug 2, 2011

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Hybrid cabling solution for higher bandwidth and millimeter wave applications2025
System packaging for cellular modem and transceiver system of heterogeneous stac2025
System packaging for millimeter wave antennas2025
Antenna modules and communication devices2025
Wireless communication technology, apparatuses, and methods2025
Antenna boards and communication devices2025
Radio frequency front-end structures2025
Integrated circuit packages, antenna modules, and communication devices2024
Wireless communication technology, apparatuses, and methods2024
Radio frequency front-end structures2024
Antenna modules and communication devices2024
Compact radio frequency (RF) communication modules with endfire and broadside an2023