Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10712759 | System and method for enhancing bandwidth of low-dropout regulators using power transmission lines for high speed input output drivers | David Zhang, Arijit Raychowdhury | 2020-07-14 |
| 9886542 | Modeling TSV interposer considering depletion capacitance and substrate effects | Ki Jin Han | 2018-02-06 |
| 9037446 | Electrical-thermal co-simulation with joule heating and convection effects for 3D systems | Jianyong Xie | 2015-05-19 |
| 8954308 | Modeling of multi-layered power/ground planes using triangle elements | Jae Young Choi | 2015-02-10 |
| 8352232 | Modeling electrical interconnections in three-dimensional structures | Ki Jin Han | 2013-01-08 |
| 8345433 | Heterogeneous organic laminate stack ups for high frequency applications | George E. White, Sidharth Dalmia, Venkatesh Sundaram | 2013-01-01 |
| 8219377 | Multi-layer finite element method for modeling of package power and ground planes | Krishna Bharath | 2012-07-10 |
| 8060457 | Systems and methods for electromagnetic band gap structure synthesis | Tae Hong Kim, Ege Engin | 2011-11-15 |
| 8013688 | Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications | George E. White, Venkatesh Sundaram, Sidharth Dalmia | 2011-09-06 |
| 7895540 | Multilayer finite difference methods for electrical modeling of packages and printed circuit boards | Ege Engin | 2011-02-22 |
| 7805834 | Method for fabricating three-dimensional all organic interconnect structures | George E. White, Venkatesh Sundaram, Sidharth Dalmia | 2010-10-05 |
| 7795995 | Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications | George E. White, Venkatesh Sundaram, Sidharth Dalmia | 2010-09-14 |
| 7705423 | Device having an array of embedded capacitors for power delivery and decoupling of high speed input/output circuitry of an integrated circuit | Ege Engin, Prathap Muthana, Krishna Srinivasan | 2010-04-27 |
| 7504706 | Packaging having an array of embedded capacitors for power delivery and decoupling in the mid-frequency range and methods of forming thereof | Ege Engin, Lixi Wan, Prathap Muthana | 2009-03-17 |
| 7489914 | Multi-band RF transceiver with passive reuse in organic substrates | Vinu Govind, Sidharth Dalmia, Amit Bavisi, Venkatesh Sundraram, George E. White | 2009-02-10 |
| 7260890 | Methods for fabricating three-dimensional all organic interconnect structures | George E. White, Venkatesh Sundaram, Sidharth Dalmia | 2007-08-28 |
| 7253788 | Mixed-signal systems with alternating impedance electromagnetic bandgap (AI-EBG) structures for noise suppression/isolation | Jinwoo Choi, Vinu Govind | 2007-08-07 |
| 7215301 | Electromagnetic bandgap structure for isolation in mixed-signal systems | Jinwoo Choi, Vinu Govind | 2007-05-08 |
| 7068124 | Integrated passive devices fabricated utilizing multi-layer, organic laminates | George E. White, Venkatesh Sundaram, Sidharth Dalmia | 2006-06-27 |
| 6987307 | Stand-alone organic-based passive devices | George E. White, Venkatesh Sundaram, Sidharth Dalmia | 2006-01-17 |
| 6900708 | Integrated passive devices fabricated utilizing multi-layer, organic laminates | George E. White, Venkatesh Sundaram, Sidharth Dalmia | 2005-05-31 |
| 6444919 | Thin film wiring scheme utilizing inter-chip site surface wiring | Laertis Economikos, Mukta S. Farooq, Michael F. McAllister, Eric D. Perfecto, Chandrika Prasad +3 more | 2002-09-03 |
| 6111414 | System, circuit, and method for testing an interconnect in a multi-chip substrate | Abijit Chatterjee, Bruce Kim | 2000-08-29 |
| 5916451 | Minimal capture pads applied to ceramic vias in ceramic substrates | Eric D. Perfecto, Chandrika Prasad, Keshav Prasad, Gordon J. Robbins, George E. White | 1999-06-29 |
| 5817543 | Method of constructing an integrated circuit memory | Michael F. McAllister, James A. McDonald, Gordon J. Robbins, Gregory Martine Wilkins | 1998-10-06 |