Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages and the resulting MLTF structure

Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages and the resulting MLTF structure

US Patent 5757079 · Granted May 26, 1998

Estimated economic value: $6,589,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Resist patterned redistribution wiring on copper polyimide via layer2025
Infrared debond damage mitigation by copper fill pattern2025
System and method for enhancing bandwidth of low-dropout regulators using power 2020
Chip-to-chip and chip-to-substrate interconnections in multi-chip semiconductor 2019
Electrodeposition systems and methods that minimize anode and/or plating solutio2018
Structure for establishing interconnects in packages using thin interposers2018
Modeling TSV interposer considering depletion capacitance and substrate effects2018
Semiconductor device contact structure having stacked nickel, copper, and tin la2017
Non-transparent microelectronic grade glass as a substrate, temporary carrier or2017
Electrodeposition systems and methods that minimize anode and/or plating solutio2017
Method for establishing interconnects in packages using thin interposers2017
Silver alloying post-chip join2017