JS

Jeremy K. Stephens

IBM: 23 patents #4,681 of 70,183Top 7%
Infineon Technologies Ag: 3 patents #4,439 of 7,486Top 60%
SA Siemens Aktiengesellschaft: 2 patents #6,658 of 22,248Top 30%
Overall (All Time): #186,044 of 4,157,543Top 5%
23
Patents All Time

Issued Patents All Time

Showing 1–23 of 23 patents

Patent #TitleCo-InventorsDate
7733964 Automatic adaptive equalization method for high-speed serial transmission link Louis L. Hsu, Karl D. Selander, Michael A. Sorna, Huihao Xu 2010-06-08
7659740 System and method of digitally testing an analog driver circuit Joseph O. Marsh, Charlie C. Hwang, James S. Mason, Huihao Xu, Matthew B. Baecher +2 more 2010-02-09
7466156 System of digitally testing an analog driver circuit Joseph O. Marsh, Charlie C. Hwang, James S. Mason, Huihao Xu, Matthew B. Baecher +2 more 2008-12-16
7352815 Data transceiver and method for equalizing the data eye of a differential input data signal Hibourahima Camara, Joseph Natonio, Karl D. Selander, Michael A. Sorna, Daniel W. Storaska 2008-04-01
7295618 Automatic adaptive equalization method and system for high-speed serial transmission link Louis L. Hsu, Karl D. Selander, Michael A. Sorna, Huihao Xu 2007-11-13
6890815 Reduced cap layer erosion for borderless contacts Johnathan E. Faltermeier, David M. Dobuzinsky, Larry Clevenger, Munir D. Naeem, Chienfan Yu +3 more 2005-05-10
6778447 Embedded DRAM system having wide data bandwidth and data transfer data protocol Louis L. Hsu, Rajiv V. Joshi, Daniel W. Storaska 2004-08-17
6775736 Embedded DRAM system having wide data bandwidth and data transfer data protocol Louis L. Hsu, Rajiv J. Joshi, Daniel W. Storaska 2004-08-10
6711078 Writeback and refresh circuitry for direct sensed DRAM macro Ciaran J. Brennan, John A. Fifield, Daniel W. Storaska 2004-03-23
6696759 Semiconductor device with diamond-like carbon layer as a polish-stop layer Lawrence A. Clevenger, Louis L. Hsu, Michael Wise 2004-02-24
6614714 Semiconductor memory system having a data clock system for reliable high-speed data transfers Louis L. Hsu, Daniel W. Storaska, Li-Kong Wang 2003-09-02
6552944 Single bitline direct sensing architecture for high speed memory device John A. Fifield, Toshiaki Kirihata, Wing K. Luk, Daniel W. Storaska 2003-04-22
6449202 DRAM direct sensing scheme Hiroyuki Akatsu, Louis L. Hsu, Daniel W. Storaska 2002-09-10
6420216 Fuse processing using dielectric planarization pillars Larry Clevenger, Louis L. Hsu, Chandrasekhar Narayan, Michael Wise 2002-07-16
6379222 Methods and apparatus for chemical mechanical planarization (CMP) of a semiconductor wafer Michael Wise, Suri Hedge 2002-04-30
6348395 Diamond as a polish-stop layer for chemical-mechanical planarization in a damascene process flow Lawrence A. Clevenger, Louis L. Hsu, Michael Wise 2002-02-19
6261914 Process for improving local uniformity of chemical mechanical polishing using a self-aligned polish rate enhancement layer Ramachandra Divakaruni, Jeffrey P. Gambino, Carl Radens 2001-07-17
6232222 Method of eliminating a critical mask using a blockout mask and a resulting semiconductor structure Michael D. Armacost, Richard A. Conti, Jeffrey P. Gambino 2001-05-15
6129610 Polish pressure modulation in CMP to preferentially polish raised features 2000-10-10
6102776 Apparatus and method for controlling polishing of integrated circuit substrates Karl E. Boggs, Kenneth M. Davis, William Francis Landers, Robert M. Merkling, Jr., Michael L. Passow 2000-08-15
6020262 Methods and apparatus for chemical mechanical planarization (CMP) of a semiconductor wafer Michael Wise, Suri Hedge 2000-02-01
5972787 CMP process using indicator areas to determine endpoint Karl E. Boggs, Chenting Lin, Joachim Nuetzel, Robert Ploessl, Maria Ronay +1 more 1999-10-26
5915183 Raised source/drain using recess etch of polysilicon Jeffrey P. Gambino, Scott D. Halle, Jack A. Mandelman 1999-06-22