| 12009445 |
Method of patterning a thin-film photovoltaic layer stack |
Shuping Lin, Raffael Reineker, Joachim Müller, Bernd Sprecher, Kay Ogassa |
2024-06-11 |
| 8668422 |
Low cost high throughput processing platform |
Leszek Niewmierzycki, David A. Barker, Daniel J. Devine, Michael Kuhlman, Ryan Pakulski +1 more |
2014-03-11 |
| 7658586 |
Advanced low cost high throughput processing platform |
Leszek Niewmierzycki, David A. Barker, Michael Kuhlman, Ryan Pakulski, Martin L. Zucker |
2010-02-09 |
| 7563068 |
Low cost high throughput processing platform |
Leszek Niewmierzycki, David A. Barker, Daniel J. Devine, Michael Kuhlman, Ryan Pakulski +1 more |
2009-07-21 |
| 7316761 |
Apparatus for uniformly etching a dielectric layer |
Kenny L. Doan, Yunsang Kim, Mahmoud Dahimene, Jingbao Liu, Bryan Pu +1 more |
2008-01-08 |
| 6913652 |
Gas flow division in a wafer processing system having multiple chambers |
— |
2005-07-05 |
| 6905624 |
Interferometric endpoint detection in a substrate etching process |
Coriolan Frum, Zhifeng Sui |
2005-06-14 |
| 6863835 |
Magnetic barrier for plasma in chamber exhaust |
James D. Carducci, Hamid Noorbakhsh, Evans Lee, Siamak Salimian, Paul Luscher +1 more |
2005-03-08 |
| 6849193 |
Highly selective process for etching oxide over nitride using hexafluorobutadiene |
Hoiman Hung, Joseph P. Caulfield, Ruiping Wang, Gerald Yin |
2005-02-01 |
| 6831742 |
Monitoring substrate processing using reflected radiation |
Zhifeng Sui, Nils Johansson, Hamid Noorbakhsh, Yu Guan |
2004-12-14 |
| 6829056 |
Monitoring dimensions of features at different locations in the processing of substrates |
Michael Barnes, John D. Holland, II, Bryan Pu, Mohit Jain, Zhifeng Sui +5 more |
2004-12-07 |
| 6797189 |
Enhancement of silicon oxide etch rate and nitride selectivity using hexafluorobutadiene or other heavy perfluorocarbon |
Hoiman Hung, Joseph P. Caulfield, Michael R. Rice, Kenneth S. Collins, Chunshi Cui |
2004-09-28 |
| 6773544 |
Magnetic barrier for plasma in chamber exhaust |
James D. Carducci, Hamid Noorbakhsh, Evans Lee, Siamak Salimian, Paul Luscher +1 more |
2004-08-10 |
| 6686293 |
Method of etching a trench in a silicon-containing dielectric material |
Yunsang Kim, Kenny L. Doan, Claes Bjorkman |
2004-02-03 |
| 6613689 |
Magnetically enhanced plasma oxide etch using hexafluorobutadiene |
Jingbao Liu, Takehiko Komatsu, Keji Horioka, Bryan Pu |
2003-09-02 |
| 6602434 |
Process for etching oxide using hexafluorobutadiene or related fluorocarbons and manifesting a wide process window |
Hoiman Hung, Joseph P. Caulfield, Ruiping Wang, Gerald Yin |
2003-08-05 |
| 6521082 |
Magnetically enhanced plasma apparatus and method with enhanced plasma uniformity and enhanced ion energy control |
Michael Barnes |
2003-02-18 |
| 6451703 |
Magnetically enhanced plasma etch process using a heavy fluorocarbon etching gas |
Jingbao Liu, Takehiko Komatsu, Keji Horioka, Bryan Pu |
2002-09-17 |
| 6440864 |
Substrate cleaning process |
Thomas J. Kropewnicki, Jeremiah T. Pender, Henry Fong, Charles Peter Auglis, Raymond Hung |
2002-08-27 |
| 6387287 |
Process for etching oxide using a hexafluorobutadiene and manifesting a wide process window |
Hoiman Hung, Joseph P. Caulfield, Ruiping Wang, Gerald Yin |
2002-05-14 |
| 6362109 |
Oxide/nitride etching having high selectivity to photoresist |
Yungsang Kim, Takehiko Komatsu, Claes Bjorkman |
2002-03-26 |
| 6326307 |
Plasma pretreatment of photoresist in an oxide etch process |
Roger Alan Lindley, Henry Fong, Yunsang Kim, Takehito Komatsu, Ajey M. Joshi +1 more |
2001-12-04 |
| 6232236 |
Apparatus and method for controlling plasma uniformity in a semiconductor wafer processing system |
Claes Bjorkman, Paul Luscher, Richard R. Mett, Michael Welch |
2001-05-15 |
