Issued Patents All Time
Showing 25 most recent of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109138 | Stacking and dispensing module | Leif J.I. Lundblad, Jan Mistander, Peer-Ake Eskelius | 2018-10-23 |
| 9502294 | Method and system for wafer level singulation | Klaus Schuegraf, Seshadri Ramaswami, Michael R. Rice, Mohsen Salek | 2016-11-22 |
| 8942461 | Method for a banknote detector device, and a banknote detector device | Leif J.I. Lundblad, Lennart Vedin | 2015-01-27 |
| 8580615 | Method and system for wafer level singulation | Klaus Schuegraf, Seshadri Ramaswami, Michael R. Rice, Mohsen Salek | 2013-11-12 |
| 7985689 | Patterning 3D features in a substrate | Eric Anthony Perozziello, Thomas J. Kropewnicki, Gregory L. Wojcik, Andreas Goebel | 2011-07-26 |
| 7458335 | Uniform magnetically enhanced reactive ion etching using nested electromagnetic coils | — | 2008-12-02 |
| 7407081 | Methods and apparatus for transferring conductive pieces during semiconductor device fabrication | Michael R. Rice, Jun Zhao, Kenneth S. Collins, Thomas Miu | 2008-08-05 |
| 7227244 | Integrated low k dielectrics and etch stops | Melissa Yu, Hongquing Shan, David Cheung, Wai-Fan Yau, Kuowei Liu +7 more | 2007-06-05 |
| 7110629 | Optical ready substrates | Lawrence C. West, Dan Maydan, Samuel Broydo | 2006-09-19 |
| 7105442 | Ashable layers for reducing critical dimensions of integrated circuit features | Hongching Shan, Kenny L. Doan, Jingbao Liu, Michael Barnes, Hong Dang Nguyen +4 more | 2006-09-12 |
| 7072534 | Optical ready substrates | Lawrence C. West, Dan Maydan, Samuel Broydo | 2006-07-04 |
| 7043106 | Optical ready wafers | Lawrence C. West, Dan Maydan, Samuel Broydo | 2006-05-09 |
| 6949203 | System level in-situ integrated dielectric etch process particularly useful for copper dual damascene | Chang-Lin Hsieh, Diana Xiaobing Ma, Brian Sy-Yuan Shieh, Gerald Yin, Jennifer Y. Sun +2 more | 2005-09-27 |
| 6902947 | Integrated method for release and passivation of MEMS structures | Jeffrey D. Chinn, Rolf Guenther, Michael Rattner, James A. Cooper, Toi Yue Becky Leung | 2005-06-07 |
| 6858153 | Integrated low K dielectrics and etch stops | Min Melissa Yu, Hongquing Shan, David Cheung, Wai-Fan Yau, Kuowei Liu +7 more | 2005-02-22 |
| 6825618 | Distributed inductively-coupled plasma source and circuit for coupling induction coils to RF power supply | Bryan Pu, Hongching Shan, Kenny L. Doan, Mike Welch, Richard R. Mett | 2004-11-30 |
| 6797639 | Dielectric etch chamber with expanded process window | James D. Carducci, Hamid Noorbakhsh, Evans Lee, Bryan Pu, Hongching Shan +3 more | 2004-09-28 |
| 6793835 | System level in-situ integrated dielectric etch process particularly useful for copper dual damascene | Lee Luo, Brian Sy-Yuan Shieh, Gerald Yin | 2004-09-21 |
| 6787475 | Flash step preparatory to dielectric etch | Zhuxu Wang, Jingbao Liu, Bryan Pu | 2004-09-07 |
| 6716302 | Dielectric etch chamber with expanded process window | James D. Carducci, Hamid Noorbakhsh, Evans Lee, Bryan Pu, Hongching Shan +3 more | 2004-04-06 |
| 6686293 | Method of etching a trench in a silicon-containing dielectric material | Yunsang Kim, Kenny L. Doan, Hongqing Shan | 2004-02-03 |
| 6669858 | Integrated low k dielectrics and etch stops | Min Melissa Yu, Hongquing Shan, David Cheung, Wai-Fan Yau, Kuowei Liu +7 more | 2003-12-30 |
| 6598726 | Machine for receiving and enclosing bank notes, where information is printed on the inside of a transparent film | Leif Lundblad | 2003-07-29 |
| 6568154 | Method and apparatus for enclosing banknotes where information is printed on the inside of a transparent film | Leif Lundblad, Gosta Edin | 2003-05-27 |
| 6568346 | Distributed inductively-coupled plasma source and circuit for coupling induction coils to RF power supply | Bryan Pu, Hongching Shan, Kenny L. Doan, Mike Welch, Richard R. Mett | 2003-05-27 |